OPA828 datasheet(3/47 Pages) TI

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5 Pin Configuration and Functions

–IN

V+

+IN

OUT

V–

Not to scale

–

Figure 5-1. OPA828 D Package, 8-Pin SOIC and DGN Package, 8-Pin HVSSOP (Top View)

Table 5-1. Pin Functions: OPA828

NAME

NO.

TYPE

DESCRIPTION

–IN

Input

Negative (inverting) input

+IN

Input

Positive (noninverting) input

1, 5, 8

—

No internal connection (can be left floating or grounded)

OUT

Output

V+

—

Positive (highest) power supply

V–

—

Negative (lowest) power supply

Thermal

Pad(1)

—

Exposed thermally conductive pad on the underside of the package. Solder the thermal pad to a

heat-spreading power or ground plane. Although electrically isolated (> 10 MΩ) from the die, tie the

thermal pad to V− or ground to minimize leakage to the input pins

(1)

DGN package only.

OUT A

V+

±IN A

OUT B

+IN A

±IN B

V±

+IN B

Not to scale

Figure 5-2. OPA2828 DGN Package, 8-Pin HVSSOP (Top View)

Table 5-2. Pin Functions: OPA2828

NAME

NO.

TYPE

DESCRIPTION

–IN A

Input

Negative (inverting) input A

+IN A

Input

Positive (noninverting) input A

–IN B

Input

Negative (inverting) input B

+IN B

Input

Positive (noninverting) input B

OUT A

Output

Output A

OUT B

Output

Output B

V+

—

Positive (highest) power supply

V–

—

Negative (lowest) power supply

Thermal

Pad(1)

—

Exposed thermally conductive pad on the underside of the package. Solder the thermal pad to a

heat-spreading power or ground plane. Although electrically isolated (> 10 MΩ) from the die, tie the

thermal pad to V− or ground to minimize leakage to the input pins

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OPA828, OPA2828

SBOS671D – SEPTEMBER 2018 – REVISED DECEMBER 2022

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