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PCAL9714 Datasheet(PDF) 48 Page - NXP Semiconductors

Part # PCAL9714
Description  Ultra low-voltage translating 14-bit SPI I/O expander with Agile I/O features, interrupt output, and reset
PDF  56 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

PCAL9714 Datasheet(HTML) 48 Page - NXP Semiconductors

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NXP Semiconductors
PCAL9714
Ultra low-voltage translating 14-bit SPI I/O expander with Agile I/O features, interrupt output, and
reset
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak
temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to
make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low
enough that the packages and/or boards are not damaged. The peak temperature of the package depends on
package thickness and volume and is classified in accordance with Table 53 and Table 54
Package reflow temperature (°C)
Volume (mm³)
Package thickness (mm)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
220
Table 53. SnPb eutectic process (from J-STD-020D)
Package reflow temperature (°C)
Volume (mm³)
Package thickness (mm)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Table 54. Lead-free process (from J-STD-020D)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all times.
Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 36.
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
MSL: Moisture Sensitivity Level
Figure 36. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow
soldering description”.
PCAL9714
All information provided in this document is subject to legal disclaimers.
© 2023 NXP B.V. All rights reserved.
Product data sheet
Rev. 1.0 — 1 May 2023
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