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PCAL9714 Datasheet(PDF) 49 Page - NXP Semiconductors |
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PCAL9714 Datasheet(HTML) 49 Page - NXP Semiconductors |
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49 / 56 page ![]() NXP Semiconductors PCAL9714 Ultra low-voltage translating 14-bit SPI I/O expander with Agile I/O features, interrupt output, and reset 16 Soldering: PCB footprints SOT616-3 Footprint information for reflow soldering of HVQFN24 package SLx Bx 0.125 Hy Gy C sot616-3_fr Dimensions in mm Ay Bx SLy SPx SPy SPy tot P 5.00 3.20 By 3.20 2.50 2.50 SLx 0.55 0.55 1.50 SPx tot 1.50 nSPx 2 nSPy 2 C 0.90 D 0.24 0.50 Ax 5.00 Hx 5.25 Hy 5.25 Gx 4.30 Gy 4.30 Issue date 09-06-15 14-06-12 solder land plus solder paste solder land (SL) solder paste deposit (SP) occupied area recommend stencil thickness: 0.1 mm Gx Hx D 0.105 P Ax SLy By Ay SPx SPy 0.19 0.24 0.9 0.85 SPx tot SPy tot nSPy nSPx detail X Figure 37. PCB footprint for SOT616-3 (HVQFN24); reflow soldering PCAL9714 All information provided in this document is subject to legal disclaimers. © 2023 NXP B.V. All rights reserved. Product data sheet Rev. 1.0 — 1 May 2023 49 / 56 |
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