DSP56721 datasheet(9/54 Pages) NXP

9 / 54 page

Symphony™ DSP56720/DSP56721 Multi-Core Audio Processors, Rev. 5

Freescale Semiconductor

2.2

Thermal Characteristics

Table 3 provides the thermal characteristics for the device.

The average chip-junction temperature (TJ) in °C can be obtained from:

TJ = TA + (PD × θJMA)

Where:

•TA = Ambient Temperature, °C

•

JMA= Package Thermal Resistance, Junction-to-Ambient, °C/W

•PD = PINT + PI/O

•PINT = IDD × VDD, Watts – Chip Internal Power

•PI/O = Power Dissipation on Input and Output Pins—User Determined

For most applications, PI/O < PINT and can be ignored. PD can be calculated using the worst-case conditions of 1.1 V and

780 mA. See Table 4 for more information.

To find TJ at 100° C, using the worst-case conditions and a four-layer board:

Storage temperature

TSTG

–65 to +150

°C

ESD protected voltage (Human Body Model)

—

2000

ESD protected voltage (Charged Device)

• All pins

• Corner pins

—

500

750

Note:

1. GND = 0 V, TJ = –40° C to 100° C, CL = 50 pF

2. Absolute maximum ratings are stress ratings only, and functional operation at the maximum is not guaranteed. Stress

beyond the maximum rating may affect device reliability or cause permanent damage to the device.

3. If the power supply ramp to full supply time is longer than 10 ms, the POR circuitry will not operate correctly, causing

erroneous operation.

Table 3. Thermal Characteristics

Characteristic

Board Type

Symbol

LQFP Values

Unit

Natural Convection, Junction-to-ambient thermal resistance1,2

Single layer board

(1s)

RθJA or θJA

57 for 80 QFP

49 for 144 QFP

°C/W

Four layer board

(2s2p)

44 for 80 QFP

40 for 144 QFP

°C/W

Junction-to-case thermal resistance3

—RθJC or θJC 10 for 80 QFP

9 for 144 QFP

°C/W

Notes:

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2, Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.

3. Thermal resistance between the die and the case top surface as measured by the cold plate method

(MIL SPEC-883 Method 1012.1).

Table 2. Maximum Ratings (Continued)

Rating1

Symbol

Value1, 2

Unit

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