µPD17P218

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6.

RECOMMENDED SOLDERING CONDITIONS

For the

µPD17P218, soldering must be performed under the following conditions.

For details of recommended conditions for surface mounting, refer to information document “Semiconductor

device mounting technology manual” (IEI-1207).

For other soldering methods, please consult with NEC sales personnel.

Table 6-1 Soldering Conditions of Surface-Mount Type

µPD17P218GT: 28-pin plastic SOP (375 mil)

Soldering Method

Soldering Conditions

Recommended Condi-

tions Reference Code

Package peak temperature: 230 ˚C, Time: 30 seconds max.

Infrared Reflow

(more than 210 ˚C), Number of soldering operations: 1,

IR30-203-1

Maximum number of days: 3 days

Note

(Afterwards, 20 hours prebaking at 125 ˚C is required)

Pin Partial Heating

Pin temperature: 300 ˚C max., Time: 3 seconds max. (per side)

—

Note:

This means the number of days after unpacking the dry pack. Storage conditions are 25 ˚C and 65 %

RH max.

Caution:

Do not use one soldering method in combination with another. (However, pin partial heating can

be performed with other soldering methods.)

Table 6-2 Soldering Conditions of Through-Hole Type

µPD17P218CT: 28-pin plastic shrink DIP (400 mil)

Soldering Method

Soldering Conditions

Wave Soldering

Solder bath temperature: 260 ˚C max., Time: 10 seconds max.

(Only for lead part)

Pin Partial Heating

Pin temperature: 300 ˚C max., Time: 10 seconds max.

Caution:

The wave soldering must be performed at the lead part only. Note that the solder must not be

directly contacted to the package body.

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