MP1660

– SYNCHRONOUS STEP-DOWN CONVERTER WITH INTERNAL MOSFETS

MP86953 Rev. 1.0

www.MonolithicPower.com

3

6/9/2020

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PIN FUNCTIONS

Pin #

Name

Description

1

VIN

Supply voltage. The MP1660 operates from a 4.5V to 16V input rail. A capacitor (C1) is

required to decouple the input rail. Connect VIN using a wide PCB trace.

2

SW

Switch output. Connect SW using a wide PCB trace.

3

GND

System ground. GND is the reference ground of the regulated output voltage. GND

requires extra consideration when designing the PCB layout. Connect GND with copper

traces and vias.

4

BST

Bootstrap. Connect a 1µF BST capacitor and a resistor between SW and BST to form a

floating supply across the high-side switch driver.

5

EN

Enable. Drive EN high to enable the MP1660. For automatic start-up, connect EN to VIN

through a 100k

Ω pull-up resistor.

6

FB

Feedback. To set the output voltage, connect FB to the tap of an external resistor divider

from the output to GND.

ABSOLUTE MAXIMUM RATINGS (1)

VIN .................................................-0.3V to +20V

VSW............................. -0.6V (-6.5V for <10ns) to

VIN + 0.3V (21V for <10ns)

VBST ...................................................... VSW + 5V

VEN .............................................. -0.3V to +5V (2)

All other pins ...................................-0.3V to +5V

Continuous power dissipation (TA = 25°C)

(3) (5)

................................................................... 2.2W

Junction temperature ................................150°C

Lead temperature .....................................260°C

Storage temperature ................ -65°C to +150°C

ESD Ratings

Human body model (HBM) ...................... 2000V

Charged device model (CDM)..................1500V

Recommended Operating Conditions (4)

Supply voltage (VIN) .........................4.5V to 16V

Output voltage (VOUT) ........0.6V to VIN x DMAX or

10V maximum

Operating junction temp (TJ) .... -40°C to +125°C

Thermal Resistance

θJA

θJC

SOT563

EVL1660-TF-00A (5) ............... 55....... 21 ... °C/W

JESD51-7 (6) ......................... 130...... 60 ... °C/W

Notes:

1) Exceeding these ratings may damage the device.

2) For

details on EN’s ABS max rating, see the Enable Control

section.

3) The maximum allowable power dissipation is a function of the

maximum junction temperature, TJ (MAX), the junction-to-

ambient

thermal

resistance,

θ

JA,

and

the

ambient

temperature, TA. The maximum allowable continuous power

dissipation at any ambient temperature is calculated by PD

(MAX) = (TJ (MAX) - TA) / θJA. Exceeding the maximum

allowable power dissipation produces an excessive die

temperature, causing the regulator to go into thermal

shutdown. Internal thermal shutdown circuitry protects the

device from permanent damage.

4) The device is not guaranteed to function outside of its

operating conditions.

5) Measured on EVL1660-TF-00A, 2-layer PCB.

6)

The value of θ

JA given in this table is only valid for comparison

with other packages and cannot be used for design purposes.

These values were calculated in accordance with JESD51-7

and simulated on a specified JEDEC board. They do not

represent the performance obtained in an actual application.