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33186 Datasheet(PDF) 15 Page - Freescale Semiconductor, Inc |
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33186 Datasheet(HTML) 15 Page - Freescale Semiconductor, Inc |
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15 / 21 page  Analog Integrated Circuit Device Data Freescale Semiconductor 15 33186 PACKAGING SOLDERING PACKAGING SOLDERING The 20 HSOP package is designed for enhanced thermal performance. The particularity of this package is its copper base plate on which the power die is soldered. The base plate is soldered on a PCB to provide heat flow to the ambient and also to provide a large thermal capacitance. Of course, the more copper area on the PCB, the better the power dissipation and transient behavior. We characterized the 20 HSOP on a double side PCB. The bottom side area of the copper is 7.8 cm2. The top surface is 2.7 cm2, see Figure 26. Figure 26. PCB Test Layout Figure 27. PHSOP20 Thermal Response Figure 27 shows the thermal response with the device soldered on to the test PCB described on Figure 26. Top Side Bottom Side 0,1 1 10 100 0,001 0,01 0,1 1 10 100 1000 10000 t, Time (s) Rth (°C/W) |
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