Analog Integrated Circuit Device Data

16

Freescale Semiconductor

33186

PACKAGING

PACKAGE DIMENSIONS

PACKAGE DIMENSIONS

Important: For the most current revision of the package, visit www.freescale.com and perform a keyword search on the 98A

number listed below.

CASE 979C–02

ISSUE A

DATE 07/22/98

SEATING

PLANE

DATUM

PLANE

BOTTOM VIEW

A

X 45

E1

E

D

h

B

M

bbb

C

20

11

10

1

E2

_

NOTES:

1. CONTROLLING DIMENSION: MILLIMETER.

2. DIMENSIONS AND TOLERANCES PER ASME

Y14.5M, 1994.

3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF

LEAD AND IS COINCIDENT WITH THE LEAD

WHERE THE LEAD EXITS THE PLASTIC BODY AT

THE BOTTOM OF THE PARTING LINE.

4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD

PROTRUSION. ALLOWABLE PROTRUSION IS

0.150 PER SIDE. DIMENSIONS D AND E1 DO

INCLUDE MOLD MISMATCH AND ARE

DETERMINED AT DATUM PLANE –H–.

5. DIMENSION b DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS

OF THE b DIMENSION AT MAXIMUM MATERIAL

CONDITION.

6. DATUMS –A– AND –B– TO BE DETERMINED AT

DATUM PLANE –H–.

7. DIMENSION D DOES NOT INCLUDE TIEBAR

PROTRUSIONS. ALLOWABLE TIEBAR

PROTRUSIONS ARE 0.150 PER SIDE.

D1

E3

A2

SECTION W–W

b

c1

b1

c

E4

A

M

aaa

C

EXPOSED

HEATSINK AREA

A

B

C

H

PIN ONE ID

10X

Y

GAUGE

PLANE

DETAIL Y

(1.600)

L

W

W

q

bbb C

L1

DIM

MIN

MAX

MILLIMETERS

A

3.000

3.400

A1

0.100

0.300

A2

2.900

3.100

A3

0.00

0.100

D

15.800

16.000

D1

11.700

12.600

D2

0.900

1.100

E

13.950

14.450

E1

10.900

11.100

E2

2.500

2.700

E3

6.400

7.200

E4

2.700

2.900

L

0.840

1.100

L1

0.350 BSC

b

0.400

0.520

b1

0.400

0.482

c

0.230

0.320

c1

0.230

0.280

e

1.270 BSC

h

–––

1.100

q

0

8

aaa

0.200

bbb

0.100

__

DH1 SUFFIX

VW1 SUFFIX (PB-FREE)

20-PIN HSOP

PLASTIC PACKAGE

98ASH70702A

ISSUE A