33186 datasheet(18/21 Pages) FREESCALE

Part #	33186

Description	H-Bridge Driver

PDF	21 Pages

Scroll/Zoom	100%

Manufacturer	FREESCALE [Freescale Semiconductor, Inc]

Direct Link	http://www.freescale.com

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18 / 21 page

Analog Integrated Circuit Device Data

Freescale Semiconductor

33186

ADDITIONAL DOCUMENTATION

THERMAL ADDENDUM (REV 2.0)

Figure 29. Thermal Test Board

Device on Thermal Test Board

Table 6. Thermal Resistance Performance

RθJA is the thermal resistance between die junction and

ambient air.

33186DH1 Pin Connections

20-Pin HSOP-EP

1.6 mm Pitch

16.0 mm x 11.0 mm Body

12.3 x 7.1 mm exposed pad

AGND

IN2

DI1

VBAT

OUT2

DI2

PGND

VBAT

OUT1

COD

PGND

IN1

VBAT

Material:

Single layer printed circuit board

FR4, 1.6 mm thickness

Cu traces, 0.07 mm thickness

Outline:

80 mm x 100 mm board area,

including edge connector for

thermal testing

Area A:

Cu heat-spreading areas on board

surface

Ambient Conditions:

Natural convection, still air

A [mm2]RθJA [°C/W]

070

300

600

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