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RT5760 Datasheet(PDF) 21 Page - Richtek Technology Corporation |
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RT5760 Datasheet(HTML) 21 Page - Richtek Technology Corporation |
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21 / 23 page ![]() RT5760 Copyright © 2019 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation. DS5760-02 December 2019 www.richtek.com 21 RFB2 CIN2 CIN1 COUT L REN VOUT VOUT EN GND GND GND GND Place the input MLCC capacitors as close to the VIN and GND pins as possible. Place the feedback components next to the FB pin. Connect feedback network behind the output Add extra vias for thermal dissipation Keep analog components away from the SW node to prevent stray capacitive noise pickup. The VIN trace should have enough width, and use several vias to shunt the high input current. Figure 11. Layout Guide |
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