MP4864A

– 64-CHANNEL, HIGH-VOLTAGE, SPST ANALOG SWITCH

MP4864A Rev. 1.0

MonolithicPower.com

6

10/20/2021

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© 2021 MPS. All Rights Reserved.

PIN FUNCTIONS (continued)

Pin #

Name

Description

N12

SWIN53

Analog switch input 53. Connect SWIN53 to the high-voltage pulse/transmitter.

N13

SWIN52

Analog switch input 52. Connect SWIN52 to the high-voltage pulse/transmitter.

N14

SWOUT19 Analog switch output 19. Connect SWOUT19 to the piezoelectric transducer.

P1

GND

Device ground.

P2

SWIN62

Analog switch input 62. Connect SWIN62 to the high-voltage pulse/transmitter.

P3

SWOUT28 Analog switch output 28. Connect SWOUT28 to the piezoelectric transducer.

P4

SWIN28

Analog switch input 28. Connect SWIN28 to the high-voltage pulse/transmitter.

P5

SWOUT26 Analog switch output 26. Connect SWOUT26 to the piezoelectric transducer.

P6

SWIN26

Analog switch input 26. Connect SWIN26 to the high-voltage pulse/transmitter.

P7

SWOUT24 Analog switch output 24. Connect SWOUT24 to the piezoelectric transducer.

P8

SWIN24

Analog switch input 24. Connect SWIN24 to the high-voltage pulse/transmitter.

P9

SWOUT22 Analog switch output 22. Connect SWOUT22 to the piezoelectric transducer.

P10

SWIN22

Analog switch input 22. Connect SWIN22 to the high-voltage pulse/transmitter.

P11

SWOUT21 Analog switch output 21. Connect SWOUT21 to the piezoelectric transducer.

P12

SWIN21

Analog switch input 21. Connect SWIN21 to the high-voltage pulse/transmitter.

P13

SWOUT52 Analog switch output 52. Connect SWOUT52 to the piezoelectric transducer.

P14

GND

Device ground.

ABSOLUTE MAXIMUM RATINGS (1)

Logic supply voltage (VLL) ........... -0.5V to +6.6V

Translator supply voltage (VDD) .... -0.5V to +16V

Analog signal range (VSIG) ............. 0V to ±105V

Junction temperature ............................... 150°C

Lead temperature .................................... 260°C

Continuous power dissipation (TA = 25°C) (2)

………………………………………………...4.8W

Storage temperature ................ -55°C to +150°C

ESD Ratings

Human body model (HBM) ......JEDEC standard

Charged device model (CDM)..JEDEC standard

All pins ................................................... Class 3

SWOUTx .............................................Class 1B

SWINx .................................................Class 1C

Other pins .............................................. Class 2

Recommended Operating Conditions (3)

Logic supply voltage (VLL) .............. 2.7V to 5.5V

Translator supply voltage (VDD) ........ 10V to 14V

Analog signal range (VSIG) ..................0 to ±90V

Junction temperature (TJ) ........ -25°C to +125°C

Thermal Resistance (4)

θJA

θJC

BGA-144 (10mmx10mm)

21

4

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θ

JA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX) - TA) / θJA. Exceeding the maximum allowable power

dissipation can cause excessive die temperature, which may

result in permanent damage to the part.

3) The device is not guaranteed to function outside of its operating

conditions.

4) Measured on JESD51-9, 4-layer PCB.