ISOTMP35-Q1 Automotive ±1.5°C, 3-kVRMS Isolated Temperature Sensor with Analog

Output with < 2 Seconds Response Time and 500 VRMS Working Voltage

1 Features

• AEC-Q100 qualified with:

– Temperature grade 0: –40°C to 150°C Ambient

Operating Temperature Range

– Device HBM ESD classification level 2

– Device CDM ESD classification level C5

• Robust integrated isolation barrier:

– Withstand isolation voltage: 3000 VRMS

– Isolation working voltage: 500 VRMS

• Isolation barrier life: > 50 years

• Temperature sensor accuracy

– ±0.5°C typical at 25°C

– ±1.5°C maximum from 0°C to 70°C

– ±2.0°C maximum from –40°C to +150°C

• Operating supply range: 2.3 V to 5.5 V

• Positive slope sensor gain: 10 mV/°C, with 500 mV

offset at 0°C

• Fast thermal response: < 2 seconds

• Short circuit protected output

• Low power consumption: 9 µA (typical)

• DFQ (SOIC-7) package

• Safety-related certifications (planned):

– 3-kVRMS isolation for 1 minute per UL 1577

2 Applications

• Silicon Carbide (SiC) PowerFET temperature

monitoring

• Insulated-Gate Bipolar Transistor (IGBT)

PowerFET temperature monitoring

• HEV/EV battery-management system (BMS)

• HEV/EV on-board charger (OBC) & wireless

charger

• HEV/EV DC/DC converter

• HEV/EV inverter & motor control

• Powertrain temperature sensor

3 Description

The ISOTMP35-Q1 is the industry’s first isolated

temperature sensor IC, combining an integrated

isolation barrier, up to 3000 VRMS withstand voltage,

with an analog temperature sensor featuring a 10

mV/°C slope from –40°C to +150°C. This integration

enables the sensor to be co-located with high voltage

heat source (for example: HV FETs, IGBTs, or

HV contactors) without requiring expensive isolation

circuitry. The direct contact with the high-voltage heat

source also provides greater accuracy and faster

thermal response compared approaches where the

sensor is placed further away to meet isolation

requirements.

Operating from a non-isolated 2.3-V to 5.5-V

supply, the ISOTMP35-Q1 allows easy integration

into applications where sub-regulated power is not

available on the high-voltage plane.

The integrated isolation barrier satisfies UL 1577

requirements. The surface mount package (7-pin

SOIC) provides excellent heat flow from the heat

source to the embedded thermal sensor, minimizing

thermal mass and providing more accurate heat-

source measurement. This reduces the need for time-

consuming thermal modeling and improves system

design margin by reducing mechanical variations due

to manufacturing and assembly.

The ISOTMP35-Q1 class-AB output driver provides

a strong 500-μA maximum output to drive capacitive

loads up to 1000 pF and is designed to directly

interface with analog-to-digital converter (ADC)

sample and hold inputs.

Packaging Information

PART NUMBER

PACKAGE(1)

PACKAGE SIZE(2)

ISOTMP35-Q1

DFQ (SOIC, 7)

4.9 mm × 6 mm

(1)

For all available packages, see the orderable addendum at

the end of the data sheet.

(2)

The package size (length × width) is a nominal value and

includes pins, where applicable.

ISOTMP35-Q1

SNIS234 – OCTOBER 2023

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. ADVANCE INFORMATION for preproduction products; subject to change

without notice.