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PACKAGE OUTLINE

C

.228-.244 TYP

[5.80-6.19]

.069 MAX

[1.75]

6X .050

[1.27]

8X .012-.020

[0.31-0.51]

2X

.150

[3.81]

.005-.010 TYP

[0.13-0.25]

0 - 8

.004-.010

[0.11-0.25]

.010

[0.25]

.016-.050

[0.41-1.27]

4X (0 -15 )

A

.189-.197

[4.81-5.00]

NOTE 3

B

.150-.157

[3.81-3.98]

NOTE 4

4X (0 -15 )

(.041)

[1.04]

SOIC - 1.75 mm max height

D0008A

SMALL OUTLINE INTEGRATED CIRCUIT

4214825/C 02/2019

NOTES:

1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.

Dimensioning and tolerancing per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed .006 [0.15] per side.

4. This dimension does not include interlead flash.

5. Reference JEDEC registration MS-012, variation AA.

1

8

.010 [0.25]

C A B

5

4

PIN 1 ID AREA

SEATING PLANE

.004 [0.1] C

SEE DETAIL A

TYPICAL

DETAIL A

SCALE 2.800

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OPA392, OPA2392

SBOS926E – JANUARY 2021 – REVISED SEPTEMBER 2023

Copyright © 2023 Texas Instruments Incorporated

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