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TDA8844 Datasheet(PDF) 64 Page - NXP Semiconductors |
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TDA8844 Datasheet(HTML) 64 Page - NXP Semiconductors |
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64 / 68 page ![]() December 16, 1997 64 Philips Semiconductors Tentative Device Specification I2C-bus controlled PAL/NTSC/SECAM TV processors TDA884X/5X-N2 series PACKAGE OUTLINES Fig.33 Plastic shrink dual in-line package; 56 leads (600 mil) SDIP56; SOT400AA1. UNIT b1 cE e MH L REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm DIMENSIONS (mm are the original dimensions) SOT400-1 95-12-06 b max. w M E e 1 1.3 0.8 0.53 0.40 0.32 0.23 52.4 51.6 14.0 13.6 3.2 2.8 0.18 1.778 15.24 15.80 15.24 17.15 15.90 2.3 5.08 0.51 4.0 MH c (e ) 1 ME A L A1 w M b1 e D A 2 Z 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. (1) (1) D (1) Z 56 1 29 28 b E pin 1 index A max. 12 A min. A max. SDIP56: plastic shrink dual in-line package; 56 leads (600 mil) SOT400-1 |
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