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TDA8844 Datasheet(PDF) 27 Page - NXP Semiconductors

Part # TDA8844
Description  I2C-bus controlled PAL/NTSC/SECAM TV processors
PDF  68 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

TDA8844 Datasheet(HTML) 27 Page - NXP Semiconductors

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December 16, 1997
27
Philips Semiconductors
Tentative Device Specification
I2C-bus controlled PAL/NTSC/SECAM TV
processors
TDA884X/5X-N2 series
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
Notes
1. All pins are protected against ESD by means of internal clamping diodes.
2. Human Body Model (HBM): R = 1.5 k
Ω; C = 100 pF.
3. Machine Model (MM): R = 0
Ω; C = 200 pF.
THERMAL CHARACTERISTICS (THERMAL RESISTANCE FROM JUNCTION TO AMBIENT IN FREE AIR)
QUALITY SPECIFICATION
In accordance with
“SNW-FQ-611E”. The number of the quality specification can be found in the “Quality Reference
Handbook”. The handbook can be ordered using the code 9398 510 63011.
Latch-up
At an ambient temperature of 70
°C nearly all pins meet the following specification:
• I
trigger ≥ 100 mA or ≥1.5VDD(max)
• Itrigger ≤−100 mA or ≤−0.5VDD(max).
Some pins have a slightly lower trigger current. The pin numbers and and the allowable trigger current are given below.
Pin 50: Itrigger ≥ 70 mA
Pin 51: Itrigger ≥ 60 mA
Pin 52: Itrigger ≥ 60 mA
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VP
supply voltage
−
9.0
V
Tstg
storage temperature
−25
+150
°C
Tamb
operating ambient temperature
0
70
°C
Tsol
soldering temperature
for 5 s
−
260
°C
Tj
operating junction temperature
−
150
°C
Ves
electrostatic handling
HBM; all pins; notes 1 and 2
−2000
+2000
V
MM; all pins; notes 1 and 3
−200
+200
V
SYMBOL
ENVELOPE
VALUE
UNIT
Rth j-a
SDIP 56
40
K/W
QFP 64
50
K/W



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