CC1312PSIP datasheet(2/80 Pages) TI1

2 / 80 page

2 Applications

• 868 and 902 to 928 MHz ISM and SRD systems 1

with down to 4 kHz of receive bandwidth

• Building automation

– Building security systems – motion detector,

electronic smart lock, door and window sensor,

garage door system, gateway

– HVAC – thermostat, wireless environmental

sensor, HVAC system controller, gateway

– Fire safety system – smoke and heat detector,

fire alarm control panel (FACP)

– Video surveillance – IP network camera

– Elevators and escalators – elevator main

control panel for elevators and escalators

• Grid infrastructure

– Smart meters – water meter, gas meter,

electricity meter, and heat cost allocators

– Grid communications – wireless

communications – long-range sensor

applications

– EV Charging infrastructure – AC charging (pile)

station

– Solar Energy - Micro inverter

– Other alternative energy – energy harvesting

• Industrial transport – asset tracking

• Factory automation and control

• Medical

• Communication equipment

– Wired networking – wireless LAN or Wi-Fi

access points, edge router

3 Description

The SimpleLink™ CC1312PSIP device is an RF certified System-in-Package (SiP) Sub-1 GHz wireless

module supporting Wi-SUN®, Wireless M-Bus, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), mioty,

proprietary systems, including the TI 15.4-Stack. The CC1312PSIP microcontroller (MCU) is based on an Arm®

Cortex® M4F main processor and optimized for low-power wireless communication and advanced sensing in grid

infrastructure, building automation, retail automation and medical applications.

The CC1312PSIP has a low sleep current of 0.9 μA with RTC and 80KB RAM retention. In addition to the main

Cortex® M4F processor, the device also has an autonomous ultra-low power Sensor Controller CPU with fast

wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at average 1-μA

system current.

The CC1312PSIP has Low SER (Soft Error Rate) FIT (Failure-in-time) for long operational lifetime. Always-on

SRAM parity minimizes risk for corruption due to potential radiation events. Consistent with many customers’ 10

to 15 years or longer life cycle requirements, TI has a product life cycle policy with a commitment to product

longevity and continuity of supply including dual sourcing of key components in the SIP.

The CC1312PSIP device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low

Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty, Sub-1 GHz MCUs, and host MCUs. CC1312PSIP

is part of a portfolio that includes pin-compatible 2.4-GHz SIPs for easy adaption of a wireless product

to multiple communication standards. The common SimpleLink Low Power F2 SDK and SysConfig system

configuration tool supports migration between devices in the portfolio. A comprehensive number of software

stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more

information, visit wireless connectivity.

Device Information

PART NUMBER(1)

PACKAGE

BODY SIZE (NOM)

CC1312PSIPMOT

QFM

7.00 mm × 7.00 mm

(1)

For the most current part, package, and ordering information for all available devices, see the Package Option Addendum in Section

13, or see the TI website.

1 See RF Core for additional details on supported protocol standards, modulation formats, and data rates.

CC1312PSIP

SWRS293 – NOVEMBER 2023

www.ti.com

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