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TMDS141 Datasheet(PDF) 5 Page - Texas Instruments

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Part # TMDS141
Description  HDMI HIDER
PDF  25 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TMDS141 Datasheet(HTML) 5 Page - Texas Instruments

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ABSOLUTE MAXIMUM RATINGS
DISSIPATION RATINGS
THERMAL CHARACTERISTICS
RECOMMENDED OPERATING CONDITIONS
TMDS141
SLLS737C – JUNE 2006 – REVISED JUNE 2007
over operating free-air temperature range (unless otherwise noted)(1)
UNIT
VCC
Supply voltage range(2)
–0.5 V to 4 V
RX, RX
2.0 V to 4 V
Voltage range
TX, TX, PRE, VSADJ, OE, I2CEN, OVS, HPDn
–0.5V to 4 V
RSCL, RSDA, TSCL, TSDA
–0.5 V to 6 V
RX, RX
±6 kV
Human body model(3)
All pins
±4 kV
Electrostatic
discharge
Charged-device model(4) (all pins)
±1500 V
Machine model (5) (all pins)
± 200 V
Continuous power dissipation
See Dissipation Rating Table
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
(3)
Tested in accordance with JEDEC Standard 22, Test Method A114-B
(4)
Tested in accordance with JEDEC Standard 22, Test Method C101-A
(5)
Tested in accordance with JEDEC Standard 22, Test Method A115-A
DERATING FACTOR (1)
TA = 70°C
PACKAGE
PCB JEDEC STANDARD
TA ≤ 25°C
ABOVE TA = 25°C
POWER RATING
40-QFN RHA
Low-K(2)
839.7 mW
8.39 mW/
°C
461.8 mW
40-QFN RHA
High-K(3)
3030.3 mW
30.3 mW/
°C
1666.6mW
(1)
This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.
(2)
In accordance with the Low-K thermal metric definitions of EIA/JESD51-3
(3)
In accordance with the High-K thermal metric definitions of EIA/JESD51-7
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
RθJB
Junction-to-board thermal
30.9
°C/W
resistance
6
RθJC Junction- to-case thermal
32.4
°C/W
resistance
2
VIH = VCC, VIL = VCC - 0.5 V, RT = 50 Ω,
PRE = Low
344
370
mW
VCC = AVCC = 3.3V, Rvsadj = 4.64 kΩ
PRE = High
381
407
PD
Device power dissipation
VIH = VCC, VIL = VCC - 0.6 V, RT = 50 Ω,
PRE = Low
484
mW
VCC = 3.6 V, AVCC = 3.3V, Rvsadj = 4.6 kΩ
PRE = High
526
MIN
NOM
MAX
UNIT
VCC
Supply voltage
3
3.3
3.6
V
TA
Operating free-air temperature
0
70
°C
TMDS DIFFERENTIAL PINS (RX/ RXC)
VIC
Input common mode voltage
VCC–400
VCC+10
mV
VID
Receiver peak-to-peak differential input voltage
150
1560
mVp-p
RVSADJ
Resistor for TMDS compliant voltage swing range
4.6
4.64
4.68
k
Ω
AVCC
TMDS Output termination voltage, see Figure 1
3
3.3
3.6
V
RT
Termination resistance, see Figure 1
45
50
55
Ω
Signaling rate
0
2.25
Gbps
5
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