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TMDS141 Datasheet(PDF) 5 Page - Texas Instruments |
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TMDS141 Datasheet(HTML) 5 Page - Texas Instruments |
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5 / 25 page ![]() www.ti.com ABSOLUTE MAXIMUM RATINGS DISSIPATION RATINGS THERMAL CHARACTERISTICS RECOMMENDED OPERATING CONDITIONS TMDS141 SLLS737C – JUNE 2006 – REVISED JUNE 2007 over operating free-air temperature range (unless otherwise noted)(1) UNIT VCC Supply voltage range(2) –0.5 V to 4 V RX, RX 2.0 V to 4 V Voltage range TX, TX, PRE, VSADJ, OE, I2CEN, OVS, HPDn –0.5V to 4 V RSCL, RSDA, TSCL, TSDA –0.5 V to 6 V RX, RX ±6 kV Human body model(3) All pins ±4 kV Electrostatic discharge Charged-device model(4) (all pins) ±1500 V Machine model (5) (all pins) ± 200 V Continuous power dissipation See Dissipation Rating Table (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential I/O bus voltages, are with respect to network ground terminal. (3) Tested in accordance with JEDEC Standard 22, Test Method A114-B (4) Tested in accordance with JEDEC Standard 22, Test Method C101-A (5) Tested in accordance with JEDEC Standard 22, Test Method A115-A DERATING FACTOR (1) TA = 70°C PACKAGE PCB JEDEC STANDARD TA ≤ 25°C ABOVE TA = 25°C POWER RATING 40-QFN RHA Low-K(2) 839.7 mW 8.39 mW/ °C 461.8 mW 40-QFN RHA High-K(3) 3030.3 mW 30.3 mW/ °C 1666.6mW (1) This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow. (2) In accordance with the Low-K thermal metric definitions of EIA/JESD51-3 (3) In accordance with the High-K thermal metric definitions of EIA/JESD51-7 over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT RθJB Junction-to-board thermal 30.9 °C/W resistance 6 RθJC Junction- to-case thermal 32.4 °C/W resistance 2 VIH = VCC, VIL = VCC - 0.5 V, RT = 50 Ω, PRE = Low 344 370 mW VCC = AVCC = 3.3V, Rvsadj = 4.64 kΩ PRE = High 381 407 PD Device power dissipation VIH = VCC, VIL = VCC - 0.6 V, RT = 50 Ω, PRE = Low 484 mW VCC = 3.6 V, AVCC = 3.3V, Rvsadj = 4.6 kΩ PRE = High 526 MIN NOM MAX UNIT VCC Supply voltage 3 3.3 3.6 V TA Operating free-air temperature 0 70 °C TMDS DIFFERENTIAL PINS (RX/ RXC) VIC Input common mode voltage VCC–400 VCC+10 mV VID Receiver peak-to-peak differential input voltage 150 1560 mVp-p RVSADJ Resistor for TMDS compliant voltage swing range 4.6 4.64 4.68 k Ω AVCC TMDS Output termination voltage, see Figure 1 3 3.3 3.6 V RT Termination resistance, see Figure 1 45 50 55 Ω Signaling rate 0 2.25 Gbps 5 Submit Documentation Feedback |
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