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SAA7740 Datasheet(PDF) 14 Page - NXP Semiconductors |
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SAA7740 Datasheet(HTML) 14 Page - NXP Semiconductors |
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14 / 28 page ![]() 1997 May 30 14 Philips Semiconductors Product specification Digital Audio Processing IC (DAPIC) SAA7740H DRAM interface The DRAM interface contains a nibble wide data bus, a 9-bit wide address bus and all necessary control signals to enable the different DRAM configurations. Timing of the control signals RAS, CAS, CAS2, A8B, OE and WE is related to the applied clock frequency of the DAPIC. The important timing parameters are the page mode cycle time (tcy;CAS), the access time (tacc;RAS), the refreshing rate and the maximum value for RAS to CAS delay time (tdRAS;CAS) (see Chapter “Timing characteristics” and Fig.10). A read/write operation will always be executed in the page mode (one row address and four column addresses) because every data transfer consists of 4 nibbles. The refresh time of the DRAM (trfsh) must be greater than; where ‘addr’ is the number of physical address lines and fas is measured in kHz. t rfsh 2addr 3f as ------------- ms > For fast DRAMs, the maximum value for RAS to CAS delay time (tdRAS;CAS) is important. Different DRAM combinations can be connected to the DAPIC. The smallest DRAM is a 64 × 4-bit (256 kbits) RAM. For this configuration, 16K data words can be stored. When this RAM is connected to the DAPIC, the MSB address signal (A8) can be felt floating. The DAPIC can address up to 1 Mbit DRAMs. However, RAMs greater than 1 Mbit can also be connected. This, therefore, implies that the redundant address lines of the RAM must be fixed to VDD or VSS or must be joined with one of the other address pins. The choice of a 256 kbit or a 1 Mbit DRAM device must be indicated by a flag bit residing in the start address control word of the different delay lines. |
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