MAX96751 datasheet(9/289 Pages) AD

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Absolute Maximum Ratings

(All voltages with respect to ground.) ...........................................

VDDIO .................................................................... -0.3V to +3.9V

VDD18 .................................................................... -0.3V to +2.0V

VDDD, VDDA .......................................................... -0.3V to +1.1V

VDD33 .................................................................... -0.3V to +3.9V

Rx__ ...................................................................... -0.3V to +3.9V

SIO__ (Active State) (Note a)................ (VDD18 - 1.1V) to VDD18

SIO__ (Inactive State) (Note a) ............................. -0.3V to +1.1V

RX_, RXC_ .............................. (VDD33 - 1.3V) to (VDD33 + 0.3V)

LMN_ ..................................................................... -0.3V to +2.0V

XRES, X2, AUX± ...................................... -0.3V to VDD18 + 0.3V

All Other Pins (Note b) .............................. -0.3V to VDDIO + 0.3V

Continuous Power Dissipation (TA = +70ºC) TQFN (Multilayer

board, derate 40mW/ºC above +70ºC) ...........................2200mW

Storage Temperature Range ..............................-40°C to +150°C

Soldering Temperature (reflow) ........................................+260°C

Note a: Active state means the device is powered up and not in Sleep or Power-down mode. Inactive means the device is not powered

up or is powered up but in Sleep or Power-down mode.

Note b: Specified maximum voltage or 3.9V, whichever is lower.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the

device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

Package Information

56-Pin TQFN

Package Code

T5688+6

Outline Number

21-0135

Land Pattern Number

90-100041

Thermal Resistance, Four-Layer Board:

Junction-to-Ambient (θJA)

25°C/W

Junction-to-Case Thermal Resistance (θJC)

1°C/W

56-Pin TQFN-SW (Side-Wettable)

Package Code

T5688Y+6

Outline Number

21-100046

Land Pattern Number

90-100048

Thermal Resistance, Four-Layer Board:

Junction-to-Ambient (θJA)

25°C/W

Junction-to-Case Thermal Resistance (θJC)

1°C/W

For the latest package outline information and land patterns (footprints), go to www.analog.com/packages. Note that a

“+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character,

but the drawing pertains to the package regardless of RoHS status.

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a

four-layer board in still air. For detailed information on package thermal considerations, refer to www.analog.com/

thermal-tutorial.

MAX96751

GMSL2 Serializer with HDMI 2.0 Input

www.analog.com

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