AMIS-30621 datasheet(4/43 Pages) AMI

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AMIS-30621 LIN Microstepping Motordriver

Data Sheet

AMI Semiconductor - Rev. 1.4

www.amis.com

3.0 Pin-out

4.0 Package Thermal Resistance

Pin Name

Pin Description

SOIC-20

HW0

Bit 0 of LIN-ADD

to be tied to GND

HW1

Bit 1 of LIN-ADD

or VDD if not used

VDD

Internal supply (needs external decoupling capacitor) 3

GND

Ground, heat sink

4,7,14,17

TST

Test pin (to be tied to ground in normal operation)

LIN

LIN-bus connection

HW2

Bit 2 of LIN-ADD

CPN

Negative connection of pump-capacitor (charge pump)

CPP

Positive connection of pump-capacitor (charge pump)

VCP

Charge-pump filter-capacitor

VBB

Battery voltage supply

12, 19

MOTYN

Negative end of phase Y coil

MOTYP

Positive end of phase Y coil

MOTXN

Negative end of phase X coil

MOTXP

Positive end of phase X coil

SWI

Switch input

SOIC-20

4.1 SO20

The junction-case thermal resistance is 28°C/W, leading to a

junction-ambient thermal resistance of 63°C/W, with the

PCB ground plane layout condition given on the figure

beside, and with:

• PCB thickness = 1.6mm

• 1 layer

• Copper thickness = 35µm

2 x (10mm x 23mm)

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