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IPS8200HQ Datasheet(PDF) 6 Page - STMicroelectronics |
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IPS8200HQ Datasheet(HTML) 6 Page - STMicroelectronics |
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6 / 36 page ![]() 3 Maximum ratings Table 2. Absolute maximum ratings Symbol Parameter Value Unit VCC Power supply voltage 45 V -VCC Reverse supply voltage -0.3 V VREG Logic supply voltage -0.3 to +6 V VFAULT ,VTWARN, VPG Voltage range on pins TWARN, FAULT, and PGOOD -0.3 to +6 V VPHASE VPHASE voltage VCC V VBOOT Bootstrap voltage VPHASE+6 V VROW Voltage range on ROW pins -0.3 to +6 V VCOL Voltage range on COL pins -0.3 to +6 V VIN Voltage level range on logic input pins -0.3 to +6 V IOUT Output current (continuous) Internally limited (1) A IR Reverse output current (per channel) -5 A IGND DC ground reverse current -250 mA IREG VREG input current -1 to +10 mA IFAULT, ITWARN, IPG Current range on pins TWARN , FAULT , and PGOOD -1 to +10 mA IIN Input current range -1 to +10 mA IROW Current range on ROW pins (ROW in ON-state) +20 mA Current range on ROW pins (ROW in OFF-state) -1 to +10 mA ICOL Current range on COL pins (COL in ON-state) -10 mA Current range on COL pins (COL in OFF-state) -1 to +10 mA VESD Electrostatic discharge (R = 1.5 kΩ; C = 100 pF) 2000 V EAS Single pulse avalanche energy per channel, all channels driven simultaneously @Tamb = 125 °C, IOUT = 0.5 A 0.5 J PTOT Power dissipation at TC = 25 °C Internally limited (1) W TJ Junction operating temperature Internally limited °C TSTG Storage temperature -55 to 150 °C 1. Protection functions are intended to avoid IC damage in fault conditions and are not intended for continuous operation. Continuous and repetitive operation of protection functions may reduce the IC lifetime. Table 3. Thermal data Symbol Parameter Value Unit Rth(JC) Thermal resistance junction-case (1) Max. 1 °C/W Rth(JA) Thermal resistance junction-ambient (2) Max. 25 °C/W 1. Rth between the die and the bottom case surface measured by cold plate as per JESD51. 2. According to JESD51-7. IPS8200HQ, IPS8200HQ-1 Maximum ratings DS14313 - Rev 2 page 6/36 |
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