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IPS8200HQ Datasheet(PDF) 6 Page - STMicroelectronics

Part # IPS8200HQ
Description  Octal high-side smart power solid-state relay with serial/parallel selectable interface on-chip
PDF  36 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

IPS8200HQ Datasheet(HTML) 6 Page - STMicroelectronics

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3
Maximum ratings
Table 2. Absolute maximum ratings
Symbol
Parameter
Value
Unit
VCC
Power supply voltage
45
V
-VCC
Reverse supply voltage
-0.3
V
VREG
Logic supply voltage
-0.3 to +6
V
VFAULT ,VTWARN,
VPG
Voltage range on pins TWARN, FAULT, and PGOOD
-0.3 to +6
V
VPHASE
VPHASE voltage
VCC
V
VBOOT
Bootstrap voltage
VPHASE+6
V
VROW
Voltage range on ROW pins
-0.3 to +6
V
VCOL
Voltage range on COL pins
-0.3 to +6
V
VIN
Voltage level range on logic input pins
-0.3 to +6
V
IOUT
Output current (continuous)
Internally limited (1)
A
IR
Reverse output current (per channel)
-5
A
IGND
DC ground reverse current
-250
mA
IREG
VREG input current
-1 to +10
mA
IFAULT, ITWARN,
IPG
Current range on pins TWARN , FAULT , and PGOOD
-1 to +10
mA
IIN
Input current range
-1 to +10
mA
IROW
Current range on ROW pins (ROW in ON-state)
+20
mA
Current range on ROW pins (ROW in OFF-state)
-1 to +10
mA
ICOL
Current range on COL pins (COL in ON-state)
-10
mA
Current range on COL pins (COL in OFF-state)
-1 to +10
mA
VESD
Electrostatic discharge (R = 1.5 kΩ; C = 100 pF)
2000
V
EAS
Single pulse avalanche energy per channel, all channels driven
simultaneously @Tamb = 125 °C, IOUT = 0.5 A
0.5
J
PTOT
Power dissipation at TC = 25 °C
Internally limited (1)
W
TJ
Junction operating temperature
Internally limited
°C
TSTG
Storage temperature
-55 to 150
°C
1. Protection functions are intended to avoid IC damage in fault conditions and are not intended for continuous operation.
Continuous and repetitive operation of protection functions may reduce the IC lifetime.
Table 3. Thermal data
Symbol
Parameter
Value
Unit
Rth(JC)
Thermal resistance junction-case (1)
Max.
1
°C/W
Rth(JA)
Thermal resistance junction-ambient (2)
Max.
25
°C/W
1. Rth between the die and the bottom case surface measured by cold plate as per JESD51.
2. According to JESD51-7.
IPS8200HQ, IPS8200HQ-1
Maximum ratings
DS14313 - Rev 2
page 6/36



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