12

Thermal management

The power dissipation in the IC is the main factor that sets the safe operating condition of the device in the

application. Therefore, it must be very carefully considered. Furthermore, the available space on the PCB should

be chosen considering the power dissipation. Heat sinking can be achieved using copper on the PCB with proper

area and thickness. Two different protections have been implemented to guarantee the safety of the device if it

overheats due to an overloaded condition or high ambient temperature. The following flowchart explains the

functionality of these protections in detail.

Figure 18. Thermal behavior

NO

Tj(i) >Ttsd

Vin(i) = H

OUT(i) Off

STAT(i) On (L)

Tc >Tcsd

NO

YES

NO

YES

Tc >Tcr

YES

NO

Tj(i) >Tjr

YES

STAT(i) Off (H)

OUT(i) On

GIPG030420151405LM

1

2

3

4

Note:

1 Thermal shutdown

2 Junction hysteresis

3 Restore to idle condition

4 Case hysteresis

IPS8200HQ, IPS8200HQ-1

Thermal management

DS14313 - Rev 2

page 23/36