Data Sheet

AD9631/AD9632

Rev. D | Page 5 of 20

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Supply Voltage (+VS to −VS)

12.6 V

Voltage Swing × Bandwidth Product

550 V × MHz

Internal Power Dissipation

PDIP (N)

1.3 W

SOIC (R)

0.9 W

Input Voltage (Common Mode)

±VS

Differential Input Voltage

±1.2 V

Output Short Circuit Duration

Observe Power

Derating Curves

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range (A Grade)

−40°C to +85°C

Lead Temperature Range (Soldering 10 sec)

300°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

METALLIZATION PHOTO

Figure 3. Dimensions shown in inches and (millimeters) Connect Substrate to −VS

THERMAL RESISTANCE

Table 3.

Package Type1

θJA

Unit

8-Lead PDIP (N)

90

°C/W

8-Lead SOIC (R)

140

°C/W

1 For device in free air.

MAXIMUM POWER DISSIPATION

The maximum power that can be safely dissipated by these

devices is limited by the associated rise in junction temperature.

The maximum safe junction temperature for plastic encapsu-

lated devices is determined by the glass transition temperature

of the plastic, approximately 150°C. Exceeding this limit tempo-

rarily may cause a shift in parametric performance due to a

change in the stresses exerted on the die by the package.

Exceeding a junction temperature of 175°C for an extended

period can result in device failure.

While the AD9631 and AD9632 are internally short circuit

protected, this may not be sufficient to guarantee that the max-

imum junction temperature (150°C) is not exceeded under all

conditions. To ensure proper operation, it is necessary to

observe the maximum power derating curves.

Figure 4. Maximum Power Dissipation vs. Temperature

ESD CAUTION

AD9631

AD9632

–IN

–IN

2

+VS

7

6

OUT

2

+VS

7

6

OUT

3

+IN

4

–VS

3

+IN

4

–VS

0.046

(1.17)

0.050 (1.27)

0.046

(1.17)

2.0

0

0.5

1.0

1.5

–50 –40 –30 –20 –10

0

10

20

30

40

50

60

70

80

90

AMBIENT TEMPERATURE (°C)

8-LEAD SOIC PACKAGE

8-LEAD PDIP PACKAGE

TJ = 150°C