| Electronic Components Datasheet Search |
|
LT3045 Datasheet(PDF) 41 Page - Analog Devices |
|
|
|||||||||||||||||||||||||||||
LT3045 Datasheet(HTML) 41 Page - Analog Devices |
|
41 / 62 page ![]() Data Sheet LT3074 analog.com Rev 0. 41 of 62 For example, for a switching converter with less than 100kHz bandwidth and a phase margin of 50°, using the VIOC buffer, the phase margin degrades by at most 2°. Hence, the phase margin for the switching converter (using the VIOC pin) is at least 48°. Given that the VIOC buffer is inside the switching converter’s feedback loop, the total capacitance on the VIOC pin must be below 20pF. Figure 89. Programming Input-to-Output Voltage Differential Figure 89 shows that the input-to-output differential voltage is easily programmable to support different application needs (PSRR vs. power dissipation) using the following equation: ������������������������������������ − ������������������������������������������ + 800������������ = ������������������������������ = ������������������������������������������������������������������ × ������1 + ������2 ������1 Furthermore, if the LT3074 EN/UV pin is pulled low, the LT3074 input voltage can rise to the switching converter’s input voltage and thus potentially violate the LT3074’s absolute maximum rating. To prevent this, the maximum LT3074 input voltage can be set using a resistor (R3) between the VIOC and IN pins of the regulator such that: ������������������������������������(������������������) = ������������������������������������������������������������������ × ������1 + ������2 + ������3 ������1 The VIOC pin is capable of sourcing 200µA and sinking 20µA. Choose R1 and R3 values such that the VIOC pin sources at least 10µA to ensure system stability. Figure 93 shows a typical VIOC application used to post-regulate the output of the LT8610A buck converter. The VIOC voltage is set at 1.1V (VINLDO – VOUTLDO is set to 300mV). The maximum LDO input voltage VINLDO(MAX) is set to 5.08V. Thermal Considerations For higher ambient temperatures, care should be taken in the layout of the PCB to ensure good hear sinking of the LT3074. The IN and OUT pins at the bottom of the package should be soldered to IN and OUT planes accordingly. In addition, the IN and OUT must be connected to large copper layers below with thermal vias; these layers spread heat dissipated by the LT3074. Placing additional vias can reduce thermal resistance further. The die temperature is calculated by multiplying the LT3074 power dissipation with the thermal resistance from the junction to ambient. The internal overtemperature protection monitors the junction temperature of the LT3074. If the junction temperature reaches approximately 168°C, the LT3074 output is shut down until the temperature drops about 7°C. CSETCAP 4.7µF COUT 10µF CIN RPG1 30kΩ RPG2 15kΩ RSETRES 5kΩ 800mV 51kΩ RASELTOP RASELBOT 0.47µF 2.2µF LSW R1 R3 R2 LT3074 BIAS BIASDF IN OUT SENSE SETCAP IMON SDA SCL ALERT ASEL AGND EN VINLDO VOUTLDO = 0.5V IOUT(MAX) = 3A VIOC PG CLKDIS SETRES BIASAF DGND PGFB 1× + – VBIAS SW FB VIN EN/UV VIN UPSTREAM DC-DC CONVERTER VFBSWITCHER |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |