LT3045 datasheet(8/62 Pages) AD

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Data Sheet

LT3074

analog.com

Rev 0.

8 of 62

(All typical specifications are at TJ(junction temperature). = 25°C and all min. and max. specifications are across

the entire operating temperature range, unless otherwise noted. COUT = 22µF, CSETCAP = 4.7µF, CBIASAF = 2.2µF,

and CBIASDF = 0.47µF, unless otherwise noted.)

PARAMETER

SYMBOL

CONDITIONS/COMMENTS

MIN

TYP

MAX

UNITS

Temperature Readback

tREFRESH_TEMP Refresh Rate

TJ = 25°C

46.08

msec

Digital Inputs (SCL, SDA)

VIH

Input High Voltage

1.35

VIL

Input Low Voltage

0.8

VHYST

Input Hysteresis TJ = 25°C

0.235

CPIN

Input Capacitance

Open Drain Outputs

(SCL, SDA, ALERT )

VOL

Output Low Voltage, ISINK = 6mA

0.4

ILEAK

Output Leakage Current, 0V ≤ VPIN ≤

5.5V

µA

Serial Bus Operating

Frequency

fSCL

400

kHz

Bus Free Time Between

Start and Stop

tBUF

1.3

µsec

Hold Time After Start

Condition (after this

period, the first clock is

generated).

tHD(STA)

0.6

µsec

Repeated Start

Condition Setup Time

tSU(STA)

0.6

10000

µsec

Stop Condition Setup

Time

tSU(STO)

0.6

µsec

Data Hold Time

tHD(DAT)

Receiving Data

µsec

Sending Data

0.3

0.9

Data Setup Time

tSU(DAT)

0.1

µsec

Stuck PMBus Timer

tTIMEOUT_SMB

msec

Serial Clock Low Period

tLOW

1.3

10000

µsec

Serial Clock High Period

tHIGH

0.6

µsec

To maintain proper performance and regulation, the BIAS voltage must satisfy the following conditions: 2.375V

≤ VBIAS ≤ 5.5V and VBIAS ≥ (VOUT + 1.2V).

Dropout voltage, VDO, is the minimum input-to-output voltage differential at a specified output current. In

dropout, the output voltage equals VIN – VDO.

Operating conditions are limited by maximum junction temperature. The regulated output voltage specification

does not apply for all possible combinations of input voltage and output current. When operating at maximum

output current, limit the input voltage range to VIN ≤ VOUT + 600mV.

The temperature reported represents the average temperature of the LT3074’s power device. Due to power

dissipation, temperature gradients, and thermal time constants across the die, the reported temperature

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