NOTES:

1.

All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.

PACKAGE OUTLINE

4224874/C 11/2023

www.ti.com

WSON - 0.8 mm max height

PLASTIC QUAD FLAT PACK- NO LEAD

DRR0012E

A

0.08 C

0.1

C A B

0.05

C

B

SYMM

SYMM

0.1 MIN

(0.13)

SECTION A-A

TYPICAL

PIN 1 INDEX AREA

3.1

2.9

3.1

2.9

0.05

0.00

0.8

0.7

SEATING PLANE

C

2X

2.5

A

A

PIN 1 ID

(45° X 0.3)

1

10X 0.5

12X 0.52

0.32

12X 0.3

0.2

(0.43) TYP

2.6

2.4

1.4

1.2

(0.2) TYP

6

7

12

13

(0.16) TYP