405EX datasheet(46/67 Pages) AMCC

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PPC405EX – PowerPC 405EX Embedded Processor

AMCC Proprietary

Revision 1.09 - August 21, 2007

Preliminary Data Sheet

Thermal Management

The following heat sink was used in the above thermal analysis:

26.92mm x 27mm x 11.43mm

The heat sink is manufactured by:

Aavid Thermalloy, P/N 62925

Table 8. Package Thermal Specifications

The PPC405EX is designed to operate within a case temperature range TC defined in “Recommended DC Operating

Conditions” on page 47. Thermal resistance values for the EPBGA packages in a convection environment are as follows:

Parameter

Symbol

Airflow

ft/min (m/sec)

Unit

0 (0)

100 (0.51)

200 (1.02)

300 (1.52)

400 (2.02)

500 (2.53)

600 (3.03)

Junction-to-ambient

thermal resistance

without heat sink

18.9

16.6

15.8

15.4

15.0

14.7

14.4

°C/W

Junction-to-ambient

thermal resistance

with heat sink

15.5

12.5

11.4

10.9

10.7

10.5

10.3

°C/W

Resistance Value

Junction-to-case thermal

resistance

8.96

°C/W

Junction-to-board thermal

resistance

13.74

°C/W

Notes:

1. Values in the table are achieved with the following JEDEC standard board: 114.5mm x 101.6mm x 1.6mm, 4 layers.

2. For a chip mounted on a card with at least one signal and two power planes, the following relationships exist:

a. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board.

b. TA = TC – PxθCA, where TA is ambient temperature and P is power consumption.

c. TCMax = TJMax – PxθJC, where TJMax is maximum junction temperature and P is power consumption.

405EX Datasheet(PDF) 46 Page - Applied Micro Circuits Corporation

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