IL3285/IL3222

8

NVE Corporation

11409 Valley View Road, Eden Prairie, MN 55344-3617

Phone: (952) 829-9217

www.isoloop.com

iso-info@nve.com

iso-apps@nve.com

Thermal Characteristics

Parameter

Symbol

Min.

Typ.

Max.

Units

Test Conditions

Junction–Ambient

Thermal Resistance

0.15" SOIC

0.3" SOIC

θ

JA

82

67

°C/W

Double-sided PCB in

free air

Junction–Case (Top)

Thermal Resistance

0.15" SOIC

0.3" SOIC

θ

JC

8

12

Junction–Ambient

Thermal Resistance

0.3" SOIC

θ

JA

46

2s2p PCB in free air

per JESD51

Junction–Case (Top)

Thermal Resistance

θ

JC

9

Power Dissipation

0.15" SOIC

0.3" SOIC

PD

700

1500

mW

Notes (apply to both driver and receiver sections):

1.

All voltages are with respect to network ground except differential I/O bus voltages.

2.

Differential input/output voltage is measured at the non-inverting terminal A with respect to the inverting terminal B.

3.

Skew limit is the maximum difference in any two channels in one device.

4.

The power-off measurement in ANSI Standard EIA/TIA-422-B applies to disabled outputs only and is not applied to combined inputs and outputs.

5.

All typical values are at VDD1, VDD2 = 5 V or VDD1= 3.3 V and TA = 25°C.

6.

While −7 V < VCM < 12 V, the minimum VOD2 with a 54 Ω load is either ½ VOD1 or 1.5 V, whichever is greater.

7.

Δ|VOD| and Δ|VOC| are the changes in magnitude of VOD and VOC, respectively, that occur when the input is changed from one logic state to the other.

8.

This applies for both power on and power off; refer to ANSI standard RS-485 for exact condition. The EIA/TIA-422-B limit does not apply for a combined

driver and receiver terminal.

9.

Includes 10 ns read enable time. Maximum propagation delay is 25 ns after read assertion.

10. Pulse skew is defined as the |tPLH − tPHL| of each channel.