BMP585 datasheet(67/71 Pages) BOSCH

67 / 71 page

Bosch Sensortec

| BST-BMP585-DS003-02

67 | 71

Document number: BST-BMP585-DS003-02

as well as in the event of applications for industrial property rights

9.2.2 Engineering Samples

Table 28: Marking of engineering samples

Position

Name

Symbol

Remark

Upper Line

Lot counter

00, 01, ...

Two numeric digits; Engineering Lot Counter

(Trace Code)

Lower Line left &

middle

Sublot ID

two alphanumeric digits; Product- and Supply

Chain identifier

Lower Line right

Eng. Sample ID

single alphanumeric digit; Engineering

identifier

Corner of pin 1

Pin 1

Orientation

Marker

Solid circle (on top side of substrate; defined

by opening in solder resist) with diameter of

275 μm

9.3 Moisture Sensitivity Level and Soldering

9.3.1 MSL and device storage

The BMP585 is classified as MSL 3 (moisture sensitivity level) according to IPC/JEDEC standards J-STD-020E and

JSTD-033D.

To ensure good solder-ability, the devices shall be stored at room temperature (20°C) before.

9.3.2 Soldering

The device has been tested for soldering according to J-STD-002E with Pb-free soldering.

The device has been tested for a total of up to 3 reflow soldering cycles. This could be a situation where a PCB is

mounted with devices from both sides (i.e., 2 reflow cycles necessary) and where in the next step an additional re-work

cycle could be required (1 reflow).

The soldering process can lead to an offset shift. The physical origin of this shift is not material aging, but mechanical

hysteresis frozen in by the soldering temperature cycle. Thus, the shift is temporary and ceases within 24 h after

soldering.

Multiple reflow cycles will not add up in multiple offset shifts. The device is in the same condition after every solder reflow

cycle.

Manual unsoldering can lead to further offset shift, especially if the soldering temperature and / or soldering time is above

the given values of 260°C and 40 s.

Avoid contact of the device with liquids or small particles.

The minimum height of the solder after reflow shall be at least 50 µm. This is required for a good mechanical decoupling

between sensor device and the printed circuit board (PCB).

9.3.3 Landing pattern

Bosch Sensortec suggests the BMP585 outline Dimensions (see section 9.1.2 “Bottom View”) as landing pattern.

When designing the solder paste silk print opening window, avoid excess solder paste to allow good reflow.

It is recommended to use a land pattern with a size of Footprint +25 μm on each side. We recommend at least 200 μm

distance between the pads. We do not recommend vias or traces under the BMP585. Furthermore, it is recommended

that there is no solder mask under the sensor. The recommended horizontal clearance for the solder mask is 20 μm on

each side. If the solder mask or other material underneath the sensor gets in contact with the sensor, there may be a

negative impact on performance.

BMP585 Datasheet(PDF) 67 Page - Bosch Sensortec GmbH

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