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PACKAGE OUTLINE

C

36X 0.5

2X

9

38X

0.27

0.17

6.6

6.2

TYP

SEATING

PLANE

0.15

0.05

0.25

GAGE PLANE

0 -8

1.2 MAX

2X 0.95 MAX

NOTE 5

2X 0.95 MAX

NOTE 5

4.70

3.94

2.90

2.43

B

4.5

4.3

A

9.8

9.6

NOTE 3

0.75

0.50

(0.15) TYP

PowerPAD TSSOP - 1.2 mm max height

DCP0038A

SMALL OUTLINE PACKAGE

4218816/A 10/2018

1

19

20

38

0.08

C A B

PIN 1 INDEX

AREA

SEE DETAIL A

0.1 C

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.15 mm per side.

4. Reference JEDEC registration MO-153.

5. Features may differ or may not be present.

TM

PowerPAD is a trademark of Texas Instruments.

A 20

DETAIL A

TYPICAL

SCALE 2.000

THERMAL

PAD

1

19

20

38

39