Rev. B 09/15

8

LYT2002-2005

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Parameter

Symbol

Conditions

SOURCE = 0 V; T

J = 0 to 100 °C

(Unless Otherwise Specified)

Min

Typ

Max

Units

Control Functions

Programmable

Maximum Frequency

f

OSC

T

J = 25 °C

t

ON × IFB = 1.4 mA-ms

See Note A

V

FB = VFBth

85

kHz

Minimum Operation

Frequency

f

OSC(MIN)

T

J = 25 °C

V

FB = VFBth

LYT2002-2003

300

330

365

Hz

LYT2004

775

850

930

LYT2005

510

580

645

Frequency Ratio

(Constant Current)

f

RATIO(CC)

T

J = 25 °C

Between V

FB = 1.0 V and VFB = 1.6 V

1.550

1.593

1.635

Frequency Ratio

(Inductance

Correction)

f

RATIO(IC)

Between t

ON × IFB = 1.4 mA and

t

ON × IFB = 2 mA-ms

1.160

1.210

1.260

Frequency Jitter

Peak-to-Peak Jitter Compared to Average

Frequency, T

J = 25 °C

±7

%

Absolute Maximum Ratings(1,6)

DRAIN Voltage .........................................................-0.3 V to 725 V

DRAIN Pin Peak Current(5): LYT2002 ......................... 504 (750) mA(2)

LYT2003 ......................... 654 (980) mA(2)

LYT2004........................686 (1029) mA(2)

LYT2005........................ 784 (1176) mA(2)

Peak Negative Pulsed Drain Current.................................. -100 mA(3)

FEEDBACK Pin Voltage ................................................... -0.3 to 9 V

FEEDBACK Pin Current .........................................................100 mA

BYPASS Pin Voltage ........................................................ -0.3 to 9 V

Storage Temperature ................................................. -65 to 150 °C

Operating Junction Temperature(4) ............................... -40 to 150 °C

Lead Temperature(5).............................................................. 260 °C

Notes:

1. All voltages referenced to SOURCE, T

A = 25 °C.

2. Higher peak Drain current allowed while Drain to Source

voltage does not exceed 400 V.

3. Duration not to exceed 2 ms.

4. Normally limited by internal circuitry.

5. 1/16 in. from case for 5 seconds.

6. Absolute Maximum Ratings specified may be applied, one

at a time without causing permanent damage to the

product. Exposure to Absolute Maximum Ratings for

extended periods of time may affect product reliability.

Thermal Resistance

Thermal Resistance: D Package:

(q

JA) ...................................... 100 °C/W

(2)

, 80 °C/W(3)

(q

JC)

(1)

.........................................................30 °C/W

E Package

(q

JA) .............................................. 105 °C/W

(4)

(q

JC) ..................................................2 °C/W

(5)

K Package

(q

JA) .............................. 45 °C/W

(6)

, 38 °C/W(7)

(q

JC) ..................................................2 °C/W

(5)

Notes:

1. Measured on pin 8 (SOURCE) close to plastic interface.

2. Soldered to 0.36 sq. in. (232 mm2), 2 oz. (610 g/m2) copper clad.

3. Soldered to 1 sq. in. (645 mm2), 2 oz. (610 g/m2) copper clad.

4. Free standing with no heat sink.

5. Measured at the back surface of tab.

6. Soldered (including exposed pad for K package) to typical

application PCB with a heat sinking area of 0.36 sq. in.

(232 mm2), 2 oz. (610 g/m2) copper clad.

7. Soldered (including exposed pad for K package) to typical

application PCB with a heat sinking area of 1 sq. in. (645 mm2),

2 oz. (610 g/m2) copper clad.