OPA348-Q1, OPA2348-Q1, OPA4348-Q1

SBOS465C – JANUARY 2009 – REVISED JANUARY 2016

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6.4 Thermal Information: OPA348-Q1

OPA348-Q1

THERMAL METRIC(1)

DBV (SOT-23)

D (SOIC)

UNIT

5 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

228.5

142.0

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

99.1

90.2

°C/W

RθJB

Junction-to-board thermal resistance

54.6

82.5

°C/W

ψJT

Junction-to-top characterization parameter

7.7

39.4

°C/W

ψJB

Junction-to-board characterization parameter

53.8

82.0

°C/W

RθJC(bottom)

Junction-to-case (bottom) thermal resistance

n/a

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.5 Thermal Information: OPA2348-Q1, OPA4348-Q1

OPA2348-Q1

OPA4348-Q1

THERMAL METRIC(1)

D (SOIC)

PW (TSSOP)

UNIT

8 PINS

14 PINS

RθJA

Junction-to-ambient thermal resistance

138.4

121

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

89.5

49.4

°C/W

RθJB

Junction-to-board thermal resistance

78.6

62.8

°C/W

ψJT

Junction-to-top characterization parameter

29.9

5.9

°C/W

ψJB

Junction-to-board characterization parameter

78.1

62.2

°C/W

RθJC(bottom)

Junction-to-case (bottom) thermal resistance

n/a

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6

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