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LMP8646

SNOSC63B – FEBRUARY 2012 – REVISED DECEMBER 2014

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Copyright © 2012–2014, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 4

6.1

Absolute Maximum Ratings ...................................... 4

6.2

ESD Ratings.............................................................. 4

6.3

Recommended Operating Conditions ....................... 4

6.4

Thermal Information .................................................. 4

6.5

Electrical Characteristics: 2.7 V ................................ 5

6.6

Electrical Characteristics: 5 V ................................... 6

6.7

Electrical Characteristics: 12 V ................................. 7

6.8

Typical Characteristics .............................................. 8

7

Detailed Description ............................................ 13

7.1

Overview ................................................................. 13

7.2

Functional Block Diagram ....................................... 13

7.3

Feature Description................................................. 13

7.4

Device Functional Modes........................................ 15

8

Application and Implementation ........................ 17

8.1

Application Information............................................ 17

8.2

Typical Applications ................................................ 17

9

Power Supply Recommendations ...................... 23

10

Layout................................................................... 23

10.1

Layout Guidelines ................................................. 23

10.2

Layout Example .................................................... 23

11

Device and Documentation Support ................. 24

11.1

Trademarks ........................................................... 24

11.2

Electrostatic Discharge Caution ............................ 24

11.3

Glossary ................................................................ 24

12

Mechanical, Packaging, and Orderable

Information ........................................................... 24

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision A (March 2013) to Revision B

Page

•

Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device

Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout

section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information

section ................................................................................................................................................................................... 1

Changes from Original (March 2013) to Revision A

Page

•

Changed layout of National Semiconductor Data Sheet to TI format .................................................................................. 22