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DM505LRBABF Datasheet(PDF) 259 Page - Texas Instruments

Part # DM505LRBABF
Description  DM505 SoC for Vision Analytics 15mm Package (ABF) Silicon Revision 2.0
PDF  295 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

DM505LRBABF Datasheet(HTML) 259 Page - Texas Instruments

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DDR_CLK
1
SPRS91v_PCB_DDR3_01
259
DM505
www.ti.com
SPRS976E – NOVEMBER 2016 – REVISED MAY 2018
Submit Documentation Feedback
Applications, Implementation, and Layout
Copyright © 2016–2018, Texas Instruments Incorporated
7.9.1
DDR3 General Board Layout Guidelines
To help ensure good signaling performance, consider the following board design guidelines:
•
Avoid crossing splits in the power plane.
•
Use the widest trace that is practical between decoupling capacitors and memory module.
•
Maintain a single reference
•
Minimize ISI by keeping impedances matched.
•
Minimize crosstalk by isolating sensitive bits, such as strobes, and avoiding return path discontinuities.
•
Keep the stub length as short as possible.
•
Add additional spacing for on-clock and strobe nets to eliminate crosstalk.
•
Maintain a common ground reference for all bypass and decoupling capacitors.
•
Take into account the differences in propagation delays between microstrip and stripline nets when
evaluating timing constraints.
7.9.2
DDR3 Board Design and Layout Guidelines
7.9.2.1
Board Designs
TI only supports board designs using DDR3 memory that follow the guidelines in this document. The
switching characteristics and timing diagram for the DDR3 memory controller are shown in Table 7-34 and
Figure 7-45.
Table 7-34. Switching Characteristics Over Recommended Operating Conditions for DDR3 Memory
Controller
NO.
PARAMETER
MIN
MAX
UNIT
1
tc(DDR_CLK)
Cycle time, DDR_CLK
1.875
2.5(1)
ns
(1) This is the absolute maximum the clock period can be. Actual maximum clock period may be limited by DDR3 speed grade and
operating frequency (see the DDR3 memory device data sheet).
Figure 7-45. DDR3 Memory Controller Clock Timing
7.9.2.2
DDR3 Device Combinations
There are several possible combinations of device counts and single- or dual-side mounting, Table 7-35
summarizes the supported device configurations.
Table 7-35. Supported DDR3 Device Combinations
NUMBER OF DDR3
DEVICES
DDR3 DEVICE WIDTH
(BITS)
ECC DEVICE WIDTH
(BITS)
MIRRORED?
DDR3 EMIF WIDTH
(BITS)
1
1x16
-
N
16
2
2x8
-
Y(1)
16
2
2x16
-
N
32
2
2x16
-
Y(1)
32
2
1x16
1x8
N
16
3
2x8
1x8
N
16
3
2x16
1x8
N
32



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