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FX23/FX23L Series/High Speed Transmission, 0.5mm Pitch Board-to-Board Floating Connectors

Storing FX23 Series

There are two types of trays ( A and B) for the FX23 Series.

These have been designed to stack in alternating order ( A- B- A- B. . . ) for shipping and storage.

If tray A is stacked on top of another tray A, or if tray B is stacked on top of another tray B, the trays will put

a load on the connectors, potentially causing connector breakage or deformation.

Tray B

Tray A

Tray A

Tray A

When stacked correctly, the outer structure of the trays will

prevent any load from being placed on the connectors below.

When stacked incorrectly, the outer structure of the trays will

not function, resulting in a load added to the connector.

OK

When storing the FX23 Series, please ensure that the trays are stacked in alternating order.

Recommended Temperature Profile

150℃

200℃

220℃

140

180

220

0

160

200

240

260

(Peak temperature : 250℃ Max.)

Soldering time

（220℃ or more）

(within 60 seconds)

(90 to 120 seconds)

Preheating time（150 to 200℃）

＜ Applicable Conditions ＞

Test PCB Dimensions

: 110× 60× 1.6mm

Material

: Glass epoxy

Solder Composition

: Sn-3Ag-0.5Cu

Flux Content

: 11wt%

Metal Mask Thickness

: 0.12mm, 0.15mm

Number of Reflow Times : 2 times Max.

*The temperature profile is a reference under the condition of

the above settings : Temperature profile may change depending

on solder paste types, manufacturers, PCB size, and other

soldering materials. Please fully check the mounting conditions

before use.