6.6 Typical Characteristics (continued)

at TA = 25°C, VS = VSOUT = ±15V, VICM = VREF = 0V, RL = 10kΩ connected to ground, and G =1V/V (unless otherwise noted)

Temperature ( C)

-40

-20

0

20

40

60

80

100

120

140

-400

-300

-200

-100

0

100

200

300

400

Mean

+3

-3

N = 36

1 wafer lot

G = 100V/V

Figure 6-7. Offset Voltage (RTI) vs Temperature

Temperature ( C)

-40

-20

0

20

40

60

80

100

120

140

-450

-350

-250

-150

-50

50

150

250

350

450

Mean

+3

-3

N = 36

1 wafer lot

G = 2V/V

Figure 6-8. Offset Voltage (RTI) vs Temperature

Temperature ( C)

-40

-20

0

20

40

60

80

100

120

140

-1600

-1200

-800

-400

0

400

800

1200

1600

Mean

+3

-3

N = 36

1 wafer lot

G = 0.5V/V

Figure 6-9. Offset Voltage (RTI) vs Temperature

Input Common-mode Voltage (V)

-14 -12 -10 -8

-6

-4

-2

0

2

4

6

8

10 12 14

-600

-200

200

600

G = 0.5

G = 1

G = 2

G = 5

G = 10

G = 20

G = 50

G = 100

CM Range

Typical unit shown

.

Figure 6-10. Offset Voltage (RTI) vs VICM

Power-supply Rejection Ratio ( V/V)

0

10

20

30

40

-1

-0.8

-0.6

-0.4

-0.2

0

0.2

0.4

0.6

0.8

1

N = 700

Mean = 0.219μV/V

Std. dev. = 0.0765μV/V

G = 100V/V

Figure 6-11. PSRR Distribution

Power-supply Rejection Ratio ( V/V)

10

20

30

-0.6

-0.3

0

0.3

0.6

N = 700

Mean = 0.203μV/V

Std. dev. = 0.101μV/V

G = 2V/V

Figure 6-12. PSRR Distribution

PGA848

SBOSAN4A – AUGUST 2025 – REVISED DECEMBER 2025

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