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OPA659 Datasheet(PDF) 3 Page - Texas Instruments |
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OPA659 Datasheet(HTML) 3 Page - Texas Instruments |
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3 / 39 page ![]() 5 Pin Configuration and Functions 1 2 3 4 8 7 6 5 + PD FB IN IN+ VS+ VS NC OUT Figure 5-1. DRG Package, 8-Pin WSON With Thermal Pad (Top View) 1 2 3 4 OUT VS- VS+ IN+ IN- 5 Figure 5-2. DBV Package, 5-Pin SOT-23 (Top View) Table 5-1. Pin Functions PIN TYPE DESCRIPTION NAME NO. DRG (WSON) DBV (SOT-23) FB 2 — Output Feedback resistor connection (optional) IN– 3 4 Input Inverting input IN+ 4 3 Input Noninverting input NC 6 — — No connect (no internal connection to die) OUT 7 1 Output Output of amplifier PD 1 — Input Power down (low = enable, high = disable). Internal 1MΩ pullup allows floating this pin. VS– 5 2 Power Negative power supply VS+ 8 5 Power Positive power supply Thermal pad Thermal pad — — Electrically isolated from the die substrate, but ESD diodes down-bonded to the thermal pad. Recommended connection to a heat-spreading plane, typically ground. www.ti.com OPA818 SBOS940B – MAY 2019 – REVISED DECEMBER 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: OPA818 |
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