7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range, unless otherwise noted (1)

MIN

MAX

UNIT

Voltage

VDD, VSENSE1,VSENSE2, VRESET1, VRESET2, VRESET1, VRESET2

–0.3

70

V

Voltage

VCTS1, VCTS2, VCTR1, VCTR2

–0.3

6

V

Current

IRESET1, IRESET2, IRESET1, IRESET2

10

mA

Temperature (2)

Operating junction temperature, TJ

–40

150

°C

Temperature (2)

Operating Ambient temperature, TA

–40

150

°C

Temperature (2)

Storage, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

As a result of the low dissipated power in this device, it is assumed that TJ = TA.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per AEC Q100-002 (1)

±2000

V

Charged device model (CDM), per AEC Q100-011

±750

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Voltage

VDD

2.7

65

V

Voltage

VSENSE1,VSENSE2, VRESET1, VRESET2, VRESET1, VRESET2

0

65

V

Voltage

VCTS1, VCTS2, VCTR1, VCTR2

0

5.5

V

Current

IRESET1, IRESET2, IRESET1, IRESET2

0

±5

mA

TJ

Junction temperature (free air temperature)

–40

125

°C

7.4 Thermal Information

THERMAL METRIC

(1)

TPS37-Q1

UNIT

DSK

DYY

10-PIN

14-PIN

RθJA

Junction-to-ambient thermal resistance

87.4

131.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

76.3

61.1

°C/W

RθJB

Junction-to-board thermal resistance

54.2

56.6

°C/W

ψJT

Junction-to-top characterization parameter

4.8

3.4

°C/W

ψJB

Junction-to-board characterization parameter

54.2

56.5

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

34.8

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

TPS37-Q1

SNVSBD9E – AUGUST 2020 – REVISED AUGUST 2023

www.ti.com

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