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TMS320DM641 Datasheet(PDF) 173 Page - Texas Instruments |
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TMS320DM641 Datasheet(HTML) 173 Page - Texas Instruments |
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173 / 179 page  PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) TMS320DM640AGDK4 ACTIVE FCBGA GDK 548 60 TBD SNPB Level-4-220C-72 HR TMS320DM640AGNZ4 ACTIVE FCBGA GNZ 548 40 TBD SNPB Level-4-220C-72 HR TMS320DM640AGNZA4 ACTIVE FCBGA GNZ 548 40 TBD SNPB Level-4-220C-72 HR TMS320DM640AZDK4 ACTIVE FCBGA ZDK 548 60 Pb-Free (RoHS Exempt) SNAGCU Level-4-260C-72HR TMS320DM640AZDKA4 ACTIVE FCBGA ZDK 548 60 Pb-Free (RoHS Exempt) SNAGCU Level-4-260C-72HR TMS320DM640AZNZ4 ACTIVE FCBGA ZNZ 548 40 Pb-Free (RoHS Exempt) SNAGCU Level-4-260C-72HR TMS320DM640AZNZA4 ACTIVE FCBGA ZNZ 548 40 Pb-Free (RoHS Exempt) SNAGCU Level-4-260C-72HR TMS320DM640GDK400 OBSOLETE FCBGA GDK 548 TBD Call TI Call TI TMS320DM640GNZ400 ACTIVE FCBGA GNZ 548 TBD Call TI Call TI TMS320DM641AGDK5 ACTIVE FCBGA GDK 548 60 TBD SNPB Level-4-220C-72 HR TMS320DM641AGDK6 ACTIVE FCBGA GDK 548 60 TBD SNPB Level-4-220C-72 HR TMS320DM641AGNZ5 ACTIVE FCBGA GNZ 548 40 TBD SNPB Level-4-220C-72 HR TMS320DM641AGNZ6 ACTIVE FCBGA GNZ 548 40 TBD SNPB Level-4-220C-72 HR TMS320DM641AZDK6 ACTIVE FCBGA ZDK 548 60 Pb-Free (RoHS Exempt) SNAGCU Level-4-260C-72HR TMS320DM641AZNZ5 ACTIVE FCBGA ZNZ 548 40 Pb-Free (RoHS Exempt) SNAGCU Level-4-260C-72HR TMS320DM641AZNZ6 ACTIVE FCBGA ZNZ 548 40 Pb-Free (RoHS Exempt) SNAGCU Level-4-260C-72HR TMS320DM641GDK500 OBSOLETE FCBGA GDK 548 TBD Call TI Call TI TMS320DM641GDK600 OBSOLETE FCBGA GDK 548 TBD Call TI Call TI TMS320DM641GNZ500 OBSOLETE FCBGA GNZ 548 TBD Call TI Call TI TMS320DM641GNZ600 ACTIVE FCBGA GNZ 548 TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. PACKAGE OPTION ADDENDUM www.ti.com 28-Apr-2008 Addendum-Page 1 |
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