ADG1407 datasheet(8/20 Pages) AD

8 / 20 page

ADG1406/ADG1407

Rev. 0 | Page 8 of 20

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 7.

Parameter

Rating

VDD to VSS

35 V

VDD to GND

−0.3 V to +25 V

VSS to GND

+0.3 V to −25 V

Analog, Digital Inputs1

VSS − 0.3 V to VDD + 0.3 V

or 30 mA, whichever

occurs first

Continuous Current, Sx or Dx Pins

Table 5 and Table 6

specifications + 15%

Peak Current, Sx or Dx Pins (Pulsed

at 1 ms, 10% Duty Cycle

Maximum)

28-Lead TSSOP

300 mA

32-Lead LFCSP_VQ

550 mA

Operating Temperature Range

Industrial (B Version)

–40°C to +125°C

Storage Temperature Range

–65°C to +150°C

Junction Temperature

150°C

Reflow Soldering, Pb-Free

Peak Temperature

260 (+0/−5)°C

Time at Peak Temperature

10 sec to 40 sec

1 Overvoltages at the Ax, EN, Sx, or Dx pins are clamped by internal diodes.

Limit current to the maximum ratings given.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Only one absolute maximum rating may be applied at any

one time.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 8. Thermal Resistance

Package Type

θJA

θJC

Unit

28-Lead TSSOP

97.9

°C/W

32-Lead LFCSP_VQ

27.27

°C/W

ESD CAUTION

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