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33742 Datasheet(PDF) 67 Page - Freescale Semiconductor, Inc |
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33742 Datasheet(HTML) 67 Page - Freescale Semiconductor, Inc |
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67 / 70 page ![]() Analog Integrated Circuit Device Data Freescale Semiconductor 67 33742 ADDITIONAL DOCUMENTATION THERMAL ADDENDUM (REV 2.0) Figure 39. Thermal Test Board Device on Thermal Test Board Table 44. Thermal Resistance Performance RθJA is the thermal resistance between die junction and ambient air. WDOG MISO SCLK GND GND GND GND CANL CANH L3 L2 L1 CS MOSI RXD RST INT GND GND GND GND V2 V2CTRL VSUP HS L0 TXD VDD 4 5 6 7 8 9 10 11 12 13 14 2 3 28 25 24 23 22 21 20 19 18 17 16 15 27 26 1 33742 Pin Connections 28-Pin SOICW 1.27 mm Pitch 18.0 mm x 7.5 mm Body A Material: Single layer printed circuit board FR4, 1.6mm thickness Cu traces, 0.07mm thickness Outline: 80mm x 100mm board area, including edge connector for thermal testing Area A: Cu heat-spreading areas on board surface Ambient Conditions: Natural convection, still air A [mm²] RθJA [°C/W] 0 68 300 52 600 47 |
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