MCF52235 datasheet(30/54 Pages) FREESCALE

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MCF52235 ColdFire Microcontroller Data Sheet, Rev. 7

Electrical Characteristics

Freescale Semiconductor

Table 20. Thermal Characteristics

Characteristic

Symbol

Package1

1 The use of this device in one- or two-layer board designs is not recommended due to the limited thermal conductance

provided by those boards.

Value

Unit

Junction to ambient, natural convection

80-pin LQFP, four-layer board

36.02,3

JMA and Ψjt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale

recommends the use of

JMA and power dissipation specifications in the system design to prevent device junction

temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures

can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature

specification can be verified by physical measurement in the customer’s system using the

jt parameter, the device power

dissipation, and the method described in EIA/JESD Standard 51-2.

3 Per JEDEC JESD51-6 with the board horizontal.

°C/W

112-pin LQFP, four-layer board

35.0

121 MAPBGA, four-layer board

80-pin LQFP, one-layer board1

49.01

121 MAPBGA, one-layer board1

561

112-pin LQFP, one-layer board1

44.01

Junction to ambient (@200 ft/min)

JMA

80-pin LQFP, four-layer board

30.0

°C/W

112-pin LQFP, four-layer board

29.0

121 MAPBGA, four-layer board

80-pin LQFP, one-layer board1

39.01

112-pin LQFP, one-layer board1

35.01

121 MAPBGA, one-layer board1

461

Junction to board

80-pin LQFP

22.04

4 Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board

temperature is measured on the top surface of the board near the package.

°C/W

112-pin LQFP

23.0

121 MAPBGA, four-layer board

Junction to case

80-pin LQFP

6.05

5 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883

Method 1012.1).

°C/W

112-pin LQFP

6.0

121 MAPBGA

Junction to top of package, natural convection

80-pin LQFP

2.06

6 Thermal characterization parameter indicating the temperature difference between package top and the junction

temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written

in conformance with Psi-JT.

°C/W

112-pin LQFP

2.06

121 MAPBGA

2.06

Maximum operating junction temperature

All

130

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