Analog Integrated Circuit Device Data

16

Freescale Semiconductor

34119

REVISION HISTORY

REVISION HISTORY

REVISION

DATE

DESCRIPTION OF CHANGES

2.0

11/2006

•

Converted to the current Freescale format

•

Implemented Revision History page

•

Removed Peak Package Reflow Temperature During Reflow (solder reflow) parameter from

Maximum Ratings on page 4. Added note with instructions from www.freescale.com

•

Updated the Package drawing to the current revision

3.0

12/2006

•

Restated note Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC

standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels

(MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter

the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. on

page 4