23

4838B–AUDR–05/05

ATR4258

5.

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating

only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this

specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

All voltages are referred to GND (pin 25)

Parameters

Symbol

Value

Unit

Supply voltage, pin 42

10

V

Power dissipation

1000

mW

Junction temperature

150

°C

Ambient temperature range

–40 to +85

°C

Storage temperature range

–50 to +150

°C

6.

Thermal Resistance

Parameters

Symbol

Value

Unit

Junction ambient, soldered to PCB

R

thJA

60

K/W

7.

Operating Range

All voltages are referred to GND (pin 25)

Parameters

Symbol

Min.

Typ.

Max.

Unit

Supply voltage range, pin 42

V

S

8.0

8.5

10

V

Ambient temperature

T

amb

–40

+85

°C

8.

Electrical Characteristics

No.

Parameters

Test Conditions

Pin

Symbol

Min.

Typ.

Max.

Unit

Type*

1Power Supply

1.1

Supply voltage

42

8.0

8.5

10

V

C

1.2

Supply current

Standby mode

(bit 92 = 0, bit 93 = 0)

42

35

45

mA

A

1.3

Supply current

Other operation modes

42

I

S

50

65

mA

A

2

VCO (Bit 52 = 0, Bit 30 = 1)

2.1

Frequency range

f

VCO

70

260

MHz

D

2.2

DC bias voltage

13

3.4

3.7

4.0

V

A

2.3

Buffer output voltage

f

16

250

mVrms

C

2.4

Buffer output resistance

16

70

Ω

D

2.5

Buffer output DC

voltage

16

3.8

4.1

4.4

V

A

3FM RF-AGC

3.1

Saturation voltage

No input signal

58.3

V

A

3.2

Saturation voltage

No input signal

V

B

3.3

Threshold level

In-band signal

30

115

dBµV

C

*) Type means: A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter