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TLV987 Datasheet(PDF) 8 Page - Texas Instruments |
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TLV987 Datasheet(HTML) 8 Page - Texas Instruments |
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8 / 20 page ![]() TLV987 3-V 10-BIT 27 MSPS AREA CCD SENSOR SIGNAL PROCESSOR SLAS211A – MARCH 1999 – REVISED SEPTEMBER 1999 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 APPLICATION INFORMATION BLKG TPP TPM OBCLP STBY RESET CS SDIN SCLK ADCCLK AVDD 0.1 µF 10 µF 0.1 µF 1 µF 0.1 µF 0.1 µF AREA CCD 0.1 µF 0.1 µF 1 µF 1 µF 1 µF 1 µF 0.1 µF 0.1 µF 0.1 µF AVDD AVDD SR SV CLAMP AVDD DVDD D (9–0) DIVDD AVDD DVDD DIVDD 3 V 3 V 1.8 V to 4.4 V Analog Ground Digital Ground BLKG TPP TPM OBCLP STBY RESET CS SDIN SCLK ADCCLK DIN AVDD4 AGND4 PIN AVDD2 AGND2 DGND DVDD D0 D1 D2 D3 D4 D5 DACT DACO2 DACO1 AVDD 1 2 3 4 5 6 7 8 9 10 11 12 36 35 34 33 32 31 30 29 28 27 26 25 TLV987CPFB OE (see Note D) NOTES: A. All analog outputs should be buffered if the load is resistive or if the load is capacitive with more than 2-pF loading. B. When using the TPP and TPM pins to test internal PGA, the AVDD supply voltage should be 3.3 V. C. Clock signals on the TPP and TPM pins are inverted. D. These two capacitors should be placed as close to the device as possible. Figure 4. Typical Application Connections |
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