SE97TP datasheet(34/53 Pages) NXP

34 / 53 page

SE97_6

Product data sheet

Rev. 06 — 17 August 2009

34 of 53

NXP Semiconductors

SE97

DDR memory module temp sensor with integrated SPD, 3.3 V

Application design-in information

In a typical application, the SE97 behaves as a slave device and interfaces to a bus

master (or host) via the SCL and SDA lines. The EVENT output is monitored by the host,

and asserts when the temperature reading exceeds the programmed values in the alarm

registers. The A0, A1 and A2 pins are directly connected to VDD or VSS without any pull-up

resistors. The SDA and SCL serial interface pins are open-drain I/Os that require pull-up

resistors, and are able to sink a maximum of 3 mA with a voltage drop less than 0.4 V.

Typical pull-up values for SCL and SDA are 10 k

Ω, but the resistor values can be changed

in order to meet the rise time requirement if the capacitance load is too large due to

routing, connectors, or multiple components sharing the same bus.

Fig 22. Typical application showing SE97 interfacing with 3.3 V host

002aab354

HOST

CONTROLLER

SE97

SCL

SDA

EVENT

VDD

10 k

Ω

×)

VSS

slave

master

3.3 V

Fig 23. SE97 interfacing with 1.1 V host controller

002aad262

HOST

CONTROLLER

SE97

SCL

SDA

EVENT

VDD

10 k

Ω

VSS

3.3 V

0.1

µF

10 k

Ω

PCA9509

mother board

0.1

µF

VCC(B)

VCC(A)

10 k

Ω

10 k

Ω

SCL

SDA

EVENT

0.1

µF

1.1 V

SE97TP Datasheet(PDF) 34 Page - NXP Semiconductors

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