SE97TP datasheet(47/53 Pages) NXP

Part #	SE97TP

Description	DDR memory module temp sensor with integrated SPD, 3.3 V

PDF	53 Pages

Scroll/Zoom	100%

Manufacturer	NXP [NXP Semiconductors]

Direct Link	http://www.nxp.com

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47 / 53 page

SE97_6

Product data sheet

Rev. 06 — 17 August 2009

47 of 53

NXP Semiconductors

SE97

DDR memory module temp sensor with integrated SPD, 3.3 V

Fig 43. Package outline SOT1069-1 (HWSON8)

References

Outline

version

European

projection

Issue date

IEC

JEDEC

JEITA

SOT1069-1

MO-229

sot1069-1_po

08-07-10

09-08-10

Unit

max

nom

min

0.80

0.75

0.70

0.05

0.02

0.2

0.30

0.25

0.20

2.1

2.0

1.9

1.6

1.4

1.6

1.4

0.5

0.45

0.35

A(1)

Dimensions

Note

1. Dimension A is including plating thickness. The package footprint is compatible with JEDEC MO229

HWSON8: plastic thermal enhanced very very thin small outline package; no leads;

8 terminals; body 2 x 3 x 0.8 mm

SOT1069-1

0.65

0.55

0.45

3.1

3.0

2.9

0.2

0.1

0.05

2 mm

scale

terminal 1

index area

×)

detail X

terminal 1

index area

1/2 e

SE97TP Datasheet(PDF) 47 Page - NXP Semiconductors

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