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SE97TP Datasheet(PDF) 53 Page - NXP Semiconductors |
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SE97TP Datasheet(HTML) 53 Page - NXP Semiconductors |
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53 / 53 page  NXP Semiconductors SE97 DDR memory module temp sensor with integrated SPD, 3.3 V © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 17 August 2009 Document identifier: SE97_6 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.1 General features . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2 Temperature sensor features . . . . . . . . . . . . . . 2 2.3 Serial EEPROM features . . . . . . . . . . . . . . . . . 2 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 5 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 7 Functional description . . . . . . . . . . . . . . . . . . . 6 7.1 Serial bus interface . . . . . . . . . . . . . . . . . . . . . . 6 7.2 Slave address . . . . . . . . . . . . . . . . . . . . . . . . . . 6 7.3 EVENT output condition . . . . . . . . . . . . . . . . . . 7 7.3.1 EVENT pin output voltage levels and resistor sizing . . . . . . . . . . . . . . . . . . . . . . . . . . 7 7.3.2 EVENT thresholds . . . . . . . . . . . . . . . . . . . . . . 9 7.3.2.1 Alarm window . . . . . . . . . . . . . . . . . . . . . . . . . . 9 7.3.2.2 Critical trip. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 7.3.3 Event operation modes . . . . . . . . . . . . . . . . . . 10 7.3.3.1 Comparator mode. . . . . . . . . . . . . . . . . . . . . . 10 7.3.3.2 Interrupt mode . . . . . . . . . . . . . . . . . . . . . . . . 10 7.4 Conversion rate. . . . . . . . . . . . . . . . . . . . . . . . 11 7.4.1 What temperature is read when conversion is in progress . . . . . . . . . . . . . . . . . . . . . . . . . 11 7.5 Power-up default condition . . . . . . . . . . . . . . . 11 7.6 Device initialization . . . . . . . . . . . . . . . . . . . . . 11 7.7 SMBus time-out . . . . . . . . . . . . . . . . . . . . . . . 12 7.8 SMBus ALERT Response Address (ARA) . . . 12 7.9 SMBus/I2C-bus interface . . . . . . . . . . . . . . . . 13 7.10 EEPROM operation . . . . . . . . . . . . . . . . . . . . 16 7.10.1 Write operations . . . . . . . . . . . . . . . . . . . . . . . 16 7.10.1.1 Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 7.10.1.2 Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 7.10.1.3 Acknowledge polling . . . . . . . . . . . . . . . . . . . . 17 7.10.2 Memory protection . . . . . . . . . . . . . . . . . . . . . 17 7.10.2.1 Permanent Write Protection (PWP) . . . . . . . . 19 7.10.2.2 Reversible Write Protection (RWP) and Clear Reversible Write Protection (CRWP) . . 19 7.10.2.3 Read Permanent Write Protection (RPWP), Read Reversible Write Protection (RRWP), and Read Clear Reversible Write Protection (RCRWP). . . . . . . . . . . . . . . . . . . . 20 7.10.3 Read operations . . . . . . . . . . . . . . . . . . . . . . . 20 7.10.3.1 Current address read . . . . . . . . . . . . . . . . . . . 20 7.10.3.2 Selective read . . . . . . . . . . . . . . . . . . . . . . . . . 20 7.10.3.3 Sequential read . . . . . . . . . . . . . . . . . . . . . . . 21 7.11 Hot plugging . . . . . . . . . . . . . . . . . . . . . . . . . . 22 8 Register descriptions . . . . . . . . . . . . . . . . . . . 22 8.1 Register overview. . . . . . . . . . . . . . . . . . . . . . 22 8.2 Capability register (00h, 16-bit read-only) . . . . . . . . . . . . . . . . . . 23 8.3 Configuration register (01h, 16-bit read/write) . . . . . . . . . . . . . . . . . . 24 8.4 Temperature format . . . . . . . . . . . . . . . . . . . . 28 8.5 Temperature Trip Point registers . . . . . . . . . . 29 8.5.1 Upper Boundary Alarm Trip register (16-bit read/write) . . . . . . . . . . . . . . . . . . . . . . 29 8.5.2 Lower Boundary Alarm Trip register (16-bit read/write) . . . . . . . . . . . . . . . . . . . . . . 30 8.5.3 Critical Alarm Trip register (16-bit read/write) . . . . . . . . . . . . . . . . . . . . . . 30 8.6 Temperature register (16-bit read-only) . . . . . . . . . . . . . . . . . . . . . . 31 8.7 Manufacturer’s ID register (16-bit read-only) . . . . . . . . . . . . . . . . . . . . . . 32 8.8 Device ID register. . . . . . . . . . . . . . . . . . . . . . 32 8.9 SMBus register. . . . . . . . . . . . . . . . . . . . . . . . 33 9 Application design-in information . . . . . . . . . 34 9.1 SE97 in memory module application . . . . . . . 35 9.2 Layout consideration . . . . . . . . . . . . . . . . . . . 35 9.3 Thermal considerations . . . . . . . . . . . . . . . . . 35 10 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 36 11 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 37 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 44 13 Soldering of SMD packages . . . . . . . . . . . . . . 48 13.1 Introduction to soldering. . . . . . . . . . . . . . . . . 48 13.2 Wave and reflow soldering . . . . . . . . . . . . . . . 48 13.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 48 13.4 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 49 14 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 50 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . 51 16 Legal information . . . . . . . . . . . . . . . . . . . . . . 52 16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 52 16.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 16.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 52 16.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 52 17 Contact information . . . . . . . . . . . . . . . . . . . . 52 18 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 |
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