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SE97TP Datasheet(PDF) 41 Page - NXP Semiconductors |
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SE97TP Datasheet(HTML) 41 Page - NXP Semiconductors |
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41 / 53 page ![]() SE97_6 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 06 — 17 August 2009 41 of 53 NXP Semiconductors SE97 DDR memory module temp sensor with integrated SPD, 3.3 V VDD = 3.0 V to 3.6 V. From 25 °C (air) to 120 °C (oil bath). (1) TSSOP8 (2) HVSON8, HWSON8, HXSON8 VDD = 3.3 V + 150 mV (p-p); 0.1 µF AC coupling capacitor; no decoupling capacitor; Tamb =25 °C. Fig 37. Package thermal response Fig 38. Temperature error versus power supply noise frequency 40 80 120 thermal response (%) 0 time (s) 05 4 23 1 002aac905 (1) (2) noise frequency (Hz) 102 108 107 106 103 105 104 002aac914 1 3 5 temp error ( °C) −1 |
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