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LPC1313 Datasheet(PDF) 41 Page - NXP Semiconductors

Part # LPC1313
Description  32-bit ARM Cortex-M3 microcontroller; up to 32 kB flash and 8 kB SRAM; USB device
PDF  53 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

LPC1313 Datasheet(HTML) 41 Page - NXP Semiconductors

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LPC1311_13_42_43_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 11 December 2009
41 of 53
NXP Semiconductors
LPC1311/13/42/43
32-bit ARM Cortex-M3 microcontroller
10.3 Internal oscillators
[1]
Parameters are valid over operating temperature range unless otherwise specified.
[2]
Typical ratings are not guaranteed. The values listed are at room temperature (25
°C), nominal supply voltages.
10.4 I2C-bus
[1]
Parameters are valid over operating temperature range unless otherwise specified.
[2]
Main clock frequency 10 MHz; system clock divider AHBCLKDIV = 0x1; I2C-bus interface configured in master mode.
[3]
Bus capacitance Cb = 550 pF; external pull-up resistance of 103 Ω.
Table 13.
Dynamic characteristic: internal oscillators
Tamb = −40 °C to +85 °C; 2.7 V ≤ VDD(3V3) ≤ 3.6 V[1].
Symbol
Parameter
Conditions
Min
Typ[2]
Max
Unit
fosc(RC)
internal RC oscillator frequency
-
11.88
12
12.12
MHz
Conditions: Frequency values are typical values. 12 MHz
± 1 % accuracy is guaranteed for
2.7 V
≤ V
DD(3V3) ≤ 3.6 V and Tamb = −40 °C to +85 °C. Variations between parts may cause the
IRC to fall outside the 12 MHz
± 1 % accuracy specification for voltages below 2.7 V.
Fig 21. Internal RC oscillator frequency f versus temperature
temperature (
°C)
−40
85
35
10
60
−15
002aae987
11.95
12.05
12.15
f
(MHz)
11.85
VDD(3V3) = 3.6 V
3.3 V
3.0 V
2.7 V
2.4 V
2.0 V
Table 14.
Dynamic characteristic: I2C-bus pins (Fast-mode Plus)
Tamb = −40 °C to +85 °C; VDD(3V3) = VDD(IO) = 3.3 V.[1][2][3]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
fSCL
SCL clock frequency
-
-
1
MHz
tf
fall time
-
-
45
ns
tSU;DAT
data set-up time
50
-
-
ns



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