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LPC1313 Datasheet(PDF) 41 Page - NXP Semiconductors |
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LPC1313 Datasheet(HTML) 41 Page - NXP Semiconductors |
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41 / 53 page ![]() LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 41 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller 10.3 Internal oscillators [1] Parameters are valid over operating temperature range unless otherwise specified. [2] Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages. 10.4 I2C-bus [1] Parameters are valid over operating temperature range unless otherwise specified. [2] Main clock frequency 10 MHz; system clock divider AHBCLKDIV = 0x1; I2C-bus interface configured in master mode. [3] Bus capacitance Cb = 550 pF; external pull-up resistance of 103 Ω. Table 13. Dynamic characteristic: internal oscillators Tamb = −40 °C to +85 °C; 2.7 V ≤ VDD(3V3) ≤ 3.6 V[1]. Symbol Parameter Conditions Min Typ[2] Max Unit fosc(RC) internal RC oscillator frequency - 11.88 12 12.12 MHz Conditions: Frequency values are typical values. 12 MHz ± 1 % accuracy is guaranteed for 2.7 V ≤ V DD(3V3) ≤ 3.6 V and Tamb = −40 °C to +85 °C. Variations between parts may cause the IRC to fall outside the 12 MHz ± 1 % accuracy specification for voltages below 2.7 V. Fig 21. Internal RC oscillator frequency f versus temperature temperature ( °C) −40 85 35 10 60 −15 002aae987 11.95 12.05 12.15 f (MHz) 11.85 VDD(3V3) = 3.6 V 3.3 V 3.0 V 2.7 V 2.4 V 2.0 V Table 14. Dynamic characteristic: I2C-bus pins (Fast-mode Plus) Tamb = −40 °C to +85 °C; VDD(3V3) = VDD(IO) = 3.3 V.[1][2][3] Symbol Parameter Conditions Min Typ Max Unit fSCL SCL clock frequency - - 1 MHz tf fall time - - 45 ns tSU;DAT data set-up time 50 - - ns |
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